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1. WO1997045869 - SEMICONDUCTOR PACKAGE AND DEVICE SOCKET

Publication Number WO/1997/045869
Publication Date 04.12.1997
International Application No. PCT/JP1997/001809
International Filing Date 28.05.1997
Chapter 2 Demand Filed 29.10.1997
IPC
G01R 1/04 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02General constructional details
04Housings; Supporting members; Arrangements of terminals
H05K 7/10 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
02Arrangements of circuit components or wiring on supporting structure
10Plug-in assemblages of components
CPC
G01R 1/0483
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
0433Sockets for IC's or transistors
0483Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
H05K 7/1061
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
02Arrangements of circuit components or wiring on supporting structure
10Plug-in assemblages of components ; , e.g. IC sockets
1053having interior leads
1061co-operating by abutting
Applicants
  • ADVANTEST CORPORATION [JP]/[JP] (AllExceptUS)
  • MATSUMURA, Shigeru [JP]/[JP] (UsOnly)
Inventors
  • MATSUMURA, Shigeru
Agents
  • WAKABAYASHI, Tadashi
Priority Data
8/13650830.05.1996JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEMICONDUCTOR PACKAGE AND DEVICE SOCKET
(FR) MONTAGE DE SEMI-CONDUCTEURS ET PRISE POUR DISPOSITIF
Abstract
(EN)
A semiconductor package (11) has a substrate (12) which is mounted with a semiconductor chip on one surface and numerous external terminals (14) arranged at prescribed pitches on the other surface. Positioning holes (13) are formed at two or more desired locations of the substrate (12) so as to ensure the dimensional accuracy between the holes and one arbitrary external terminal (14a).
(FR)
L'invention porte sur un montage de semi-conducteur (11) comportant un substrat (12) recevant une puce de semi-conducteur sur une surface et comportant plusieurs bornes extérieures (14) disposées à intervalles prescrits sur l'autre surface. Des trous de positionnement (13) sont percés en au moins deux points donnés du substrat (12) de manière à garantir la précision d'alignement entre les trous et une borne extérieure quelconque (14a).
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