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Machine translation
1. (WO1997040530) SOLDER BUMP APPARATUS, ELECTRONIC COMPONENT AND METHOD FOR FORMING A SOLDER BUMP
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1997/040530    International Application No.:    PCT/US1997/001145
Publication Date: 30.10.1997 International Filing Date: 24.01.1997
Chapter 2 Demand Filed:    02.10.1997    
IPC:
H01L 21/48 (2006.01), H01L 21/60 (2006.01), H01L 23/485 (2006.01), H01L 23/498 (2006.01), H05K 3/34 (2006.01)
Applicants: MOTOROLA INC. [US/US]; 1303 East Algonquin Road, Schaumburg, IL 60196 (US)
Inventors: MASTERTON, Patrick, J.; (US)
Agent: CREPS, Heather, L.; Motorola Inc., Intellectual Property Dept., 1303 East Algonquin Road, Schaumburg, IL 60196 (US).
CREPS Heather, L.; Motorola, inc.,, 1303 East Algonquin Road, Schaumburg, IL 60196 (US)
Priority Data:
08/635,111 19.04.1996 US
Title (EN) SOLDER BUMP APPARATUS, ELECTRONIC COMPONENT AND METHOD FOR FORMING A SOLDER BUMP
(FR) APPAREIL POUR PERLE DE SOUDURE, COMPOSANT ELECTRONIQUE ET PROCEDE PERMETTANT DE FORMER UNE PERLE DE SOUDURE.
Abstract: front page image
(EN)The solder bump apparatus includes a substantially conductive region (14) and a slot (16) projecting from the substantially conductive region (14). A solder resist region (12) at least in part surrounds a perimeter of the substantially conductive region (14) and a perimeter of the slot (16). A solder bump (22) is formed on the conductive region (14) and at least a portion of the solder resist region (12).
(FR)Un appareil pour perle de soudure comprend une zone sensiblement conductrice (14) et une rainure (16) s'étendant depuis la zone sensiblement conductrice (14). Une zone de réserve de brasage (12) entoure au moins partiellement un périmètre de la zone sensiblement conductrice (14) et un périmètre de la rainure (16). Une perle de soudure (22) est formée sur la région conductrice (14) et sur au moins une partie de la zone de réserve de brasage (12).
Designated States: JP, KR, SG.
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: English (EN)
Filing Language: English (EN)