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1. WO1997040206 - DEVICE AND METHOD FOR CONTINUOUS VAPOR-DEPOSITION ON FILM

Publication Number WO/1997/040206
Publication Date 30.10.1997
International Application No. PCT/JP1997/001368
International Filing Date 21.04.1997
IPC
C23C 14/24 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
C23C 14/30 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
28by wave energy or particle radiation
30by electron bombardment
C23C 14/56 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
CPC
C23C 14/246
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
246Replenishment of source material
C23C 14/30
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
28by wave energy or particle radiation
30by electron bombardment
C23C 14/562
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
562for coating elongated substrates
Applicants
  • TOYO METALLIZING CO., LTD. [JP]/[JP] (AllExceptUS)
  • TOHYAMA, Shunroku [JP]/[JP] (UsOnly)
  • AOYAGI, Tsutomu [JP]/[JP] (UsOnly)
  • MOCHIZUKI, Kiyohito [JP]/[JP] (UsOnly)
  • TANI, Satoru [JP]/[JP] (UsOnly)
Inventors
  • TOHYAMA, Shunroku
  • AOYAGI, Tsutomu
  • MOCHIZUKI, Kiyohito
  • TANI, Satoru
Agents
  • KAGAWA, Mikio
Priority Data
8/12408922.04.1996JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) DEVICE AND METHOD FOR CONTINUOUS VAPOR-DEPOSITION ON FILM
(FR) DISPOSITIF ET PROCEDE POUR LE DEPOT EN PHASE VAPEUR EN CONTINU SUR UN FILM
Abstract
(EN)
A device for continuous vapor-depositing on a film a thin layer having a highly accurate and uniform thickness and structure by providing a plurality of EBs (electron guns)/a plurality of evaporation points and the optimum design of the number of evaporation sources and the positions thereof to realize width-direction uniformity and the extremely high productivity. A method for continuous vapor-deposition of a film using the device is also disclosed. The device which continuously forms a single thin layer or multiple thin layers of a dielectric substance of metal having a width (L) of over 500 nm on a continuously running organic polymer film by using such a vapor-depositing system that an evaporation source material is housed in a hearth which is moving at a fixed speed and the evaporation source is continuously supplied to the point where an electron beam is applied. The device has the following features: (1) two or more electron beam applied points are provided for one kind of vapor-depositing material in the width direction of the film; (2) the vertical distance (D) between the electronic beam applied points and the film running is 300 mm; (3) the moving direction and moving speed of the hearth can be set separately, and (4) an appropriate correcting plate is provided between the electron beam applied points and the film so as to uniform the vapor-depositing speed distribution in the width direction.
(FR)
L'invention concerne un dispositif pour former sur un film, en continu et par dépôt en phase vapeur, une couche mince ayant une épaisseur uniforme très précise. Ce dispositif comprend une pluralité de canons à électrons et une pluralité de points d'évaporation dont la construction et la position sont optimisées pour assurer l'uniformité dans le sens de la largeur et permettre une productivité très élevée. L'invention concerne, également, un procédé de dépôt en phase vapeur d'un film au moyen de ce dispositif. Le dispositif forme en continu une seule ou plusieurs couches minces d'une substance diélectrique en métal ayant une largeur (L), supérieure à 500 nm sur un film de polymère organique se déplaçant en continu, grâce à un système de dépôt en phase vapeur, un matériau à évaporer depuis une source étant logé dans un foyer qui se déplace à une vitesse fixe et où la source d'évaporation est appliquée, d'une manière continue, au point d'application du faisceau électronique. Le dispositif a les caractéristiques suivantes: (1) deux points d'application des faisceaux d'électrons ou davantage sont prévus pour un type de matériau à appliquer en phase vapeur dans le sens de la largeur du film, (2) la distance verticale (D) entre les points d'application du faisceau électronique et le film en mouvement est de 300 mm, (3) le sens de déplacement et la vitesse de déplacement du foyer peuvent être fixés séparément et (4) une plaque de correction appropriée est prévue, entre les points d'application du faisceau d'électrons et le film, de manière à uniformiser la répartition de la vitesse de dépôt de vapeur dans le sens de la largeur.
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