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Machine translation
1. (WO1997039611) METHOD AND DEVICE FOR REMOVING IC COMPONENT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1997/039611    International Application No.:    PCT/JP1997/001307
Publication Date: 23.10.1997 International Filing Date: 16.04.1997
Chapter 2 Demand Filed:    16.10.1997    
IPC:
H05K 13/04 (2006.01)
Applicants: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 1006, Oaza Kadoma, Kadoma-shi, Osaka 571 (JP) (For All Designated States Except US).
NISHIDA, Kazuto [JP/JP]; (JP) (For US Only)
Inventors: NISHIDA, Kazuto; (JP)
Agent: AOYAMA, Tamotsu; Aoyama & Partners, IMP Building, 3-7, Shiromi 1-chome, Chuo-ku, Osaka-shi, Osaka 540 (JP)
Priority Data:
8/93708 16.04.1996 JP
Title (EN) METHOD AND DEVICE FOR REMOVING IC COMPONENT
(FR) PROCEDE ET DISPOSITIF SERVANT A ENLEVER UN COMPOSANT DE CIRCUIT INTEGRE
Abstract: front page image
(EN)When an IC component (1) is removed from the board (3), the tool (21) is positioned just above the IC component. Then the tool is descended to a predetermined position and covers the IC component mounted on the substrate by means of an adhesive agent, solder, or paste. Then, the IC component is removed from the substrate by rotating the tool. The IC component can be stripped off with a relatively small force so that a crack in the IC component as well as damage to the board is prevented to a minimum.
(FR)Quand un composant (1) de circuit intégré est enlevé de la plaquette (3), l'outil (21) est placé immédiatement au-dessus du composant. L'outil est ensuite descendu jusqu'à une position prédéterminée et recouvre ledit composant monté sur le substrat au moyen d'un agent adhésif, d'une soudure ou d'une pâte. Ce composant est alors enlevé du substrat par rotation de l'outil. Ce composant peut être arraché au moyen d'une force relativement limitée, de manière à empêcher au maximum toute fissure dans le composant, ainsi que toute détérioration de la plaquette.
Designated States: CA, KR, US.
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)