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Machine translation
1. (WO1997037521) METHOD AND APPARATUS FOR REDUCING WARPAGE OF AN ASSEMBLY SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1997/037521    International Application No.:    PCT/US1997/004685
Publication Date: 09.10.1997 International Filing Date: 20.03.1997
Chapter 2 Demand Filed:    25.09.1997    
IPC:
H05K 3/30 (2006.01)
Applicants: INTEL CORPORATION [US/US]; 2200 Mission College Boulevard, Santa Clara, CA 95052 (US) (For All Designated States Except US).
BUTLER, Peter, O. [US/US]; (US) (For US Only).
SUAREZ-GARTNER, Ricardo, E. [VE/US]; (US) (For US Only)
Inventors: BUTLER, Peter, O.; (US).
SUAREZ-GARTNER, Ricardo, E.; (US)
Agent: TAYLOR, Edwin, H.; Blakely, Sokoloff, Taylor & Zafman, 12400 Wilshire Boulevard, 7th Floor, Los Angeles, CA 90025 (US)
Priority Data:
08/625,794 29.03.1996 US
Title (EN) METHOD AND APPARATUS FOR REDUCING WARPAGE OF AN ASSEMBLY SUBSTRATE
(FR) PROCEDE ET APPAREIL POUR REDUIRE LE VOILEMENT D'UN SUBSTRAT D'ASSEMBLAGE
Abstract: front page image
(EN)A method and apparatus for reducing warpage of an assembly substrate (10) and providing registration between a surface mount technology (SMT) component (16) and the assembly substrate. The SMT component (16) includes mounting pins (18) extending from the component and capable of engaging corresponding apertures (14) in the assembly substrate (10). Each mounting pin (18) is registrable with a corresponding aperture (14) in the assembly substrate (10). The mounting pins (18) are capable of providing an interference fit between the SMT component (16) and the assembly substrate (10).
(FR)L'invention concerne un procédé et un appareil pour réduire le voilement d'un substrat d'assemblage (10) et assurer une concordance entre un composant (16) de technologie de montage en surface (SMT) et le substrat d'assemblage. Le composant SMT (16) comprend des broches de montage (18) s'étendant à partir du composant, conçues pour s'engager dans des ouvertures correspondantes (14) du substrat d'assemblage (10). Chaque broche de montage (18) correspond à une ouverture (14) du substrat (10). Les broches de montage (18) peuvent fournir un joint à ajustement serré entre le composant SMT (16) et le substrat d'assemblage (10).
Designated States: AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GE, GH, HU, IL, IS, JP, KE, KG, KP, KR, KZ, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, TJ, TM, TR, TT, UA, UG, US, UZ, VN, YU.
African Regional Intellectual Property Organization (GH, KE, LS, MW, SD, SZ, UG)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)