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1. WO1997034024 - MEANS FOR VACUUM COATING OF BULK MATERIAL

Publication Number WO/1997/034024
Publication Date 18.09.1997
International Application No. PCT/DE1997/000344
International Filing Date 27.02.1997
Chapter 2 Demand Filed 09.10.1997
IPC
C23C 14/02 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
02Pretreatment of the material to be coated
C23C 14/22 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
H01J 37/34 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes
34operating with cathodic sputtering
CPC
C23C 14/022
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
02Pretreatment of the material to be coated
021Cleaning or etching treatments
022by means of bombardment with energetic particles or radiation
C23C 14/22
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
C23C 14/223
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
223specially adapted for coating particles
H01J 37/32192
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
32192Microwave generated discharge
H01J 37/32752
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32431Constructional details of the reactor
32733Means for moving the material to be treated
32752for moving the material across the discharge
H01J 37/3405
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
34operating with cathodic sputtering
3402using supplementary magnetic fields
3405Magnetron sputtering
Applicants
  • ROBERT BOSCH GMBH [DE]/[DE] (AllExceptUS)
  • BURGER, Kurt [DE]/[DE] (UsOnly)
  • VOIGT, Johannes [DE]/[DE] (UsOnly)
  • REUTER, Wolfgang [DE]/[DE] (UsOnly)
Inventors
  • BURGER, Kurt
  • VOIGT, Johannes
  • REUTER, Wolfgang
Priority Data
196 09 804.113.03.1996DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) EINRICHTUNG ZUM VAKUUMBESCHICHTEN VON SCHÜTTGUT
(EN) MEANS FOR VACUUM COATING OF BULK MATERIAL
(FR) DISPOSITIF DE DEPOT SOUS VIDE SUR DES MATIERES EN VRAC
Abstract
(DE) Vorgeschlagen wird eine Einrichtung zum Vakuumbeschichten von Schüttgut (1). Die Einrichtung umfaßt einen Drehkorb (10) zur Aufnahme des Schüttgutes (1), eine innerhalb des Drehkorbes (10) angeordnete Plasmabeschichtungsquelle (20), sowie eine innerhalb des Drehkorbes (10) angeordnete Einrichtung (16, 24) zur Plasmareinigung des Schüttgutes (1). Während der Beschichtung ist die Drehgeschwindigkeit des Drehkorbes (10) kleiner als die zur Erzeugung einer das Schüttgut (1) an der Drehkorbinnenwand fixierenden Fliehkraft erforderliche Geschwindigkeit. Plasmabeschichtungsquelle (20) und Plasmareiningungseinrichtung (16, 24) sind so angeordnet, daß sich ihre Wirkungsbereiche überlagern.
(EN) The invention relates to means for vacuum coating of bulk material (1). Said means comprises a rotating bucket (10) for holding the bulk material (1), a plasma-coating source (20) arranged inside the rotating bucket (10), and means (16, 24), inside the rotating bucket (10), for plasma cleaning of the bulk material (1). During coating, the speed of rotation of the rotating bucket (10) is lower that the speed required to produce a centrifugal force fixing the bulk material (1) to the inner wall of the rotating bucket. The plasma-coating source (20) and the plasma cleaning means (16, 24) are arranged in such a manner that the operative areas thereof overlap.
(FR) L'invention concerne un dispositif de dépôt sous vide sur des matières en vrac (1). Ce dispositif comprend un panier rotatif (10) pour abriter la matière en vrac (1), une source de dépôt au plasma (20) disposée à l'intérieur du panier rotatif (10), ainsi qu'un dispositif (16, 24) disposé à l'intérieur du panier rotatif (10) pour décaper au plasma la matière en vrac. Pendant l'opération de revêtement, la vitesse de rotation du panier rotatif (10) est inférieure à la vitesse nécessaire pour produire une force centrifuge qui plaque la matière en vrac sur la paroi intérieure du panier rotatif. La source de dépôt au plasma (20) et le dispositif de décapage au plasma (16, 24) sont disposés de sorte que leurs zones d'action se chevauchent.
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