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1. WO1997031516 - COMPONENT SUCTION METHOD

Publication Number WO/1997/031516
Publication Date 28.08.1997
International Application No. PCT/JP1997/000543
International Filing Date 26.02.1997
Chapter 2 Demand Filed 20.08.1997
IPC
H05K 13/04 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components
CPC
H05K 13/0409
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components ; , e.g. of leadless components
0404Pick-and-place heads or apparatus, e.g. with jaws
0408Incorporating a pick-up tool
0409Sucking devices
H05K 13/0417
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components ; , e.g. of leadless components
0417Feeding with belts or tapes
Y10T 29/53178
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53174Means to fasten electrical component to wiring board, base, or substrate
53178Chip component
Y10T 29/53183
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53174Means to fasten electrical component to wiring board, base, or substrate
53183Multilead component
Applicants
  • MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP]/[JP] (AllExceptUS)
  • SUZUKI, Hideo [JP]/[JP] (UsOnly)
  • INOUE, Mamoru [JP]/[JP] (UsOnly)
  • ANDO, Takashi [JP]/[JP] (UsOnly)
Inventors
  • SUZUKI, Hideo
  • INOUE, Mamoru
  • ANDO, Takashi
Agents
  • AOYAMA, Tamotsu
  • Eisenführ, Speiser & Partner
Priority Data
8/17090201.07.1996JP
8/3808626.02.1996JP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) COMPONENT SUCTION METHOD
(FR) PROCEDE D'ASPIRATION DE COMPOSANT
Abstract
(EN)
The method includes feeding component (8) accommodated in component storage spaces (9c) of a tape base (9a) to a predetermined position, lowering a nozzle (7) capable of sucking the component supplied to the predetermined position, stopping the nozzle (7) with a predetermined distance from an upper surface of the tape base, pushing an undersurface of the component up when the nozzle is at a bottom dead center or a position adjacent to the center, vacuum-sucking the component by the nozzle at the bottom dead center or the position adjacent to the center, and moving the component sucked by the nozzle to a predetermined position of a board after the vacuum-sucking. The storage space (9c) or the nozzle (7) has an extra air inlet to improve the suction of the micro component (8).
(FR)
Le procédé consiste à amener un composant (8) se trouvant dans des espaces de stockage (9c), d'une base de bande (9a) vers un emplacement prédéterminé, à faire descendre une tuyère (7) susceptible d'aspirer ce composant transféré audit emplacement, à arrêter la tuyère (7) à une distance prédéterminée de la face supérieure de la base de la bande, à soulever la face inférieure du composant lorsque la tuyère se trouve au point mort bas ou à un emplacement contigu du centre, à faire aspirer par dépression le composant à l'endroit susmentionné puis à déplacer le composant aspiré par la tuyère vers un emplacement prédéterminé d'une plaque après l'aspiration par dépression. L'espace de stockage (9c) ou la tuyère (7) est pourvu d'un orifice spécial d'admission d'air afin d'améliorer l'aspiration du micro-composant (8).
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