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1. WO1997030478 - SEMICONDUCTOR DEVICE AND MULTILAYERED LEAD FRAME USED FOR THE SAME

Publication Number WO/1997/030478
Publication Date 21.08.1997
International Application No. PCT/JP1997/000405
International Filing Date 14.02.1997
Chapter 2 Demand Filed 08.08.1997
IPC
H01L 23/16 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
16Fillings or auxiliary members in containers, e.g. centering rings
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H01L 23/433 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
433Auxiliary members characterised by their shape, e.g. pistons
CPC
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 23/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
16Fillings or auxiliary members in containers ; or encapsulations; , e.g. centering rings
H01L 23/3107
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
3107the device being completely enclosed
H01L 23/3121
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
3107the device being completely enclosed
3121a substrate forming part of the encapsulation
H01L 23/4334
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
433Auxiliary members ; in containers; characterised by their shape, e.g. pistons
4334Auxiliary members in encapsulations
H01L 24/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
Applicants
  • NITTO DENKO CORPORATION [JP]/[JP] (AllExceptUS)
  • HOTTA, Yuji [JP]/[JP] (UsOnly)
  • KONDO, Seiji [JP]/[JP] (UsOnly)
  • OIZUMI, Shinichi [JP]/[JP] (UsOnly)
  • SAKAMOTO, Michie [JP]/[JP] (UsOnly)
  • MOCHIZUKI, Amane [JP]/[JP] (UsOnly)
Inventors
  • HOTTA, Yuji
  • KONDO, Seiji
  • OIZUMI, Shinichi
  • SAKAMOTO, Michie
  • MOCHIZUKI, Amane
Agents
  • HAGINO, Taira
Priority Data
8/2763815.02.1996JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEMICONDUCTOR DEVICE AND MULTILAYERED LEAD FRAME USED FOR THE SAME
(FR) DISPOSITIF A SEMI-CONDUCTEUR ET GRILLE DE CONNEXION MULTICOUCHE UTILISEE POUR LEDIT DISPOSITIF
Abstract
(EN)
A semiconductor device which is reduced in thickness, wherein on its one side (A) is exposed the back side of a metal sheet (12) that carries a semiconductor element (2). The device can be mass-produced by solving the problem which has been encountered at the time of injecting a resin in a packaging process. A multilayered lead frame (1) comprises an inner lead section (11a) and a metal sheet (12) for carrying a semiconductor element, which are bonded on opposite sides of a binding member (3) having a base (31) sandwiched between adhesive layers (32 and 33). The inner lead (11a) and the element have their respective upper faces C and D in the same plane to eliminate steps between bonding faces, so that the device can be made thin and dam bars can be eliminated. This invention is effective to thin semiconductor devices thinner than 1 mm.
(FR)
L'invention concerne un dispositif à semi-conducteur d'épaisseur réduite, dans lequel l'arrière d'une plaque métallique (12) portant un élément semi-conducteur (2) est exposé sur un côté (A). Il est possible de produire le dispositif en masse si l'on résout le problème rencontré au moment de l'injection d'une résine durant le processus d'encapsulation. Une grille de connexion multicouche (1) comprend une section de connexion interne (11a) et une plaque métallique (12) portant un élément semi-conducteur, qui sont collées sur les côtés opposés d'un élément de liaison (3) dont la base (31) est intercalée entre les couches adhésives (32, 33). La grille interne (11a) et l'élément ont leurs faces supérieures (C, D) dans le même plan, de façon à éliminer les marches d'escalier entre les faces de collage, ce qui permet de fabriquer un dispositif mince et de supprimer les joints d'enveloppe. Cette invention est efficace pour les dispositifs à semi-conducteur ayant une épaisseur inférieure à 1 mm.
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