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1. WO1997030475 - ADHESIVE SHEET FOR SEMICONDUCTOR CONNECTING SUBSTRATE, ADHESIVE-BACKED TAPE FOR TAB, ADHESIVE-BACKED TAPE FOR WIRE-BONDING CONNECTION, SEMICONDUCTOR CONNECTING SUBSTRATE, AND SEMICONDUCTOR DEVICE

Publication Number WO/1997/030475
Publication Date 21.08.1997
International Application No. PCT/JP1997/000453
International Filing Date 19.02.1997
IPC
C08G 59/24 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20characterised by the epoxy compounds used
22Di-epoxy compounds
24carbocyclic
C08L 55/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
55Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/-C08L53/211
C08L 77/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
C09J 7/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
02on carriers
C09J 163/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
H01L 23/495 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
495Lead-frames
CPC
C08G 59/245
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
20characterised by the epoxy compounds used
22Di-epoxy compounds
24carbocyclic
245aromatic
C08L 2666/02
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
2666Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
C08L 55/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
55Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
C08L 77/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain
C09J 163/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C09J 2203/326
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2203Applications of adhesives in processes or use of adhesives in the form of films or foils
326for bonding electronic components such as wafers, chips or semiconductors
Applicants
  • TORAY INDUSTRIES, INC. [JP]/[JP] (AllExceptUS)
  • SAWAMURA, Yasushi [JP]/[JP] (UsOnly)
  • KIGOSHI, Shoji [JP]/[JP] (UsOnly)
  • HATANO, Taku [JP]/[JP] (UsOnly)
  • KONISHI, Yukitsuna [JP]/[JP] (UsOnly)
  • ANDO, Yoshio [JP]/[JP] (UsOnly)
Inventors
  • SAWAMURA, Yasushi
  • KIGOSHI, Shoji
  • HATANO, Taku
  • KONISHI, Yukitsuna
  • ANDO, Yoshio
Priority Data
8/3050019.02.1996JP
8/3050119.02.1996JP
8/3178220.02.1996JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ADHESIVE SHEET FOR SEMICONDUCTOR CONNECTING SUBSTRATE, ADHESIVE-BACKED TAPE FOR TAB, ADHESIVE-BACKED TAPE FOR WIRE-BONDING CONNECTION, SEMICONDUCTOR CONNECTING SUBSTRATE, AND SEMICONDUCTOR DEVICE
(FR) FEUILLE ADHESIVE POUR SUBSTRAT DE CONNEXIONS DE SEMI-CONDUCTEURS, BANDE ADHESIVE UTILISEE POUR LE SOUDAGE SUR BANDE, BANDE ADHESIVE POUR MICROCABLAGE, SUBSTRAT DE CONNEXIONS DE SEMI-CONDUCTEURS ET DISPOSITIF SEMI-CONDUCTEUR
Abstract
(EN)
An adhesive sheet for semiconductor connecting substrate is a laminate which has an adhesive layer containing a thermosetting resin (A) and an epoxy resin (B), the epoxy resin (B) containing, as an essential component, at least one kind of epoxy selected from among (I) an epoxy resin having a dicyclopentadien skeleton, (II) an epoxy resin having a terpene skeleton, (III) an epoxy resin having a biphenyl skeleton, and (IV) an epoxy resin having a naphthalene skeleton. An adhesive-backed tape for TAB is a laminate which has an adhesive layer and a protective film layer both formed on a flexible insulating film, the softening temperature of the adhesive layer after curing being 60-100 °C and the insulation resistance dropping time of the layer when the layer is left after a DC voltage of 100 V is applied across the layer in an environment of 130 °C temperature and 85 % relative humidity being more than 50 hours. An adhesive-backed tape for wire-bonding connection is constituted of a laminate which has an adhesive layer and a protective layer both formed on a flexible insulating film, the softening temperature of the adhesive layer after curing being 120-170 °C, the storage elastic modulus D' at 150 °C of the adhesive layer being 20-100 MPa, and the insulation resistance dropping time of the layer when the layer is left after a DC voltage of 100 V is applied across the layer in the environment of 130 °C temperature and 85 % relative humidity being more than 50 hours. The adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, and adhesive-backed tape for wire-bonding connection have excellent adhesive forces, insulating properties, dimensional accuracy, etc., and can improve the reliabilities of semiconductor integrated circuit connecting substrates and semiconductor devices.
(FR)
Une feuille adhésive pour substrat de connexions de semi-conducteurs est un stratifié qui a une couche adhésive contenant une résine thermodurcissable (A) et une résine époxyde (B), la résine époxyde (B) contenant, en tant que composant principal, au moins une sorte d'époxy sélectionnée parmi (I) une résine époxyde à squelette dicyclopentadiène, (II) une résine époxyde à squelette terpène, (III) une résine époxyde à squelette biphényle, (IV) et une résine époxyde à squelette naphtalène. Une bande adhésive pour soudage sur bande est un stratifié qui a une couche adhésive et un film protecteur formés tous deux sur un film isolant flexible, la température de ramollissement de la couche adhésive après durcissement étant comprise entre 60 °C et 100 °C et la durée de chute de la résistance d'isolement de la couche lorsque cette dernière est laissée après l'application d'une tension en courant continu de 100 V à travers la couche, dans un environnement à 130 °C de température et à 85 % d'humidité relative, étant supérieure à 50 heures. Une bande adhésive pour microcâblage est constituée d'un stratifié qui a une couche adhésive et une couche protectrice formées toutes deux sur un film isolant flexible, la température de ramollissement de la couche adhésive après durcissement étant comprise entre 120 °C et 170 °C, le module d'élasticité de stockage D' à 150 °C de la couche adhésive étant compris entre 20 et 100 MPa, et la durée de chute de la résistance d'isolement de la couche lorsque cette dernière est laissée après l'application d'une tension en courant continu de 100 V à travers la couche, dans un environnement à 130 °C de température et à 85 % d'humidité relative, étant supérieure à 50 heures. La feuille adhésive pour substrat de connexions de semi-conducteurs, la bande adhésive pour le soudage sur bande, et la bande adhésive pour microcâblage possèdent d'excellentes propriétés adhésives, isolantes, offrent une précision dimensionnelle, etc. et peuvent améliorer la fiabilité des substrats de connexion de circuits intégrés de semi-conducteurs et des dispositifs semi-conducteurs.
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