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1. WO1997029490 - ANISOTROPIC CONDUCTIVE COMPOSITION

Publication Number WO/1997/029490
Publication Date 14.08.1997
International Application No. PCT/JP1997/000318
International Filing Date 07.02.1997
Chapter 2 Demand Filed 03.03.1997
IPC
H01B 1/22 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 3/32 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
CPC
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 3/323
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
321by conductive adhesives
323by applying an anisotropic conductive adhesive layer over an array of pads
Y10T 428/24917
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
24Structurally defined web or sheet [e.g., overall dimension, etc.]
24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
24917including metal layer
Applicants
  • ASAHI KASEI KOGYO KABUSHIKI KAISHA [JP]/[JP] (AllExceptUS)
  • YOKOYAMA, Akinori [JP]/[JP] (UsOnly)
  • MORI, Toru [JP]/[JP] (UsOnly)
Inventors
  • YOKOYAMA, Akinori
  • MORI, Toru
Agents
  • ASAMURA, Kiyoshi
Priority Data
8/15977020.06.1996JP
8/2276708.02.1996JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ANISOTROPIC CONDUCTIVE COMPOSITION
(FR) COMPOSITION ANISOTROPE CONDUCTRICE
Abstract
(EN)
An anisotropic conductive composition containing 1 pts. wt. of copper alloy powder containing 10-10,000 ppm oxygen and 0.5-250 pts. wt. of organic binder, wherein a copper compound exists on the surface of each particle of the copper alloy powder.
(FR)
L'invention porte sur une composition anisotrope conductrice comprenant 1 partie en poids de poudre d'alliage de cuivre, contenant de 10 à 10 000 ppm d'oxygène et 0,5 à 250 parties en poids d'un liant organique, et telle qu'un composé de cuivre recouvre la surface des différentes particules de l'alliage de cuivre.
Latest bibliographic data on file with the International Bureau