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1. WO1997027619 - METHOD OF MANUFACTURING COOLING DEVICES MADE UP OF SEVERAL METAL SHAPED-SECTION ELEMENTS FOR MOUNTING ON SEMICONDUCTOR COMPONENTS, SHAPED-SECTION ELEMENTS FOR USE IN THE MANUFACTURE OF SUCH COOLING DEVICES AND COOLING DEVICES MANUFACTURED BY THE METHOD

Publication Number WO/1997/027619
Publication Date 31.07.1997
International Application No. PCT/DE1997/000130
International Filing Date 17.01.1997
Chapter 2 Demand Filed 24.05.1997
IPC
H01L 21/48 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201
H01L 23/367 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367Cooling facilitated by shape of device
CPC
F28F 2215/10
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
2215Fins
10Secondary fins, e.g. projections or recesses on main fins
F28F 3/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
3Plate-like or laminated elements; Assemblies of plate-like or laminated elements
02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
H01L 21/4882
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814Conductive parts
4871Bases, plates or heatsinks
4882Assembly of heatsink parts
H01L 23/367
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Y10T 29/4935
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
49Method of mechanical manufacture
4935Heat exchanger or boiler making
Applicants
  • DIELS, Manfred [DE]/[DE]
  • BAYER, Joachim [DE]/[DE] (UsOnly)
Inventors
  • DIELS, Manfred
  • BAYER, Joachim
Agents
  • SCHRÖTER, Martin
Priority Data
196 02 943.027.01.1996DE
196 19 207.211.05.1996DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUR HERSTELLUNG VON AUS MEHREREN TEILPROFILEN AUS METALL BESTEHENDEN KÜHLKÖRPERN ZUM ANBAU AN HALBLEITERBAUELEMENTE SOWIE PROFILE ZUR HERSTELLUNG SOLCHER KÜHLKÖRPER UND NACH DEM VERFAHREN HERGESTELLTE KÜHLKÖRPER
(EN) METHOD OF MANUFACTURING COOLING DEVICES MADE UP OF SEVERAL METAL SHAPED-SECTION ELEMENTS FOR MOUNTING ON SEMICONDUCTOR COMPONENTS, SHAPED-SECTION ELEMENTS FOR USE IN THE MANUFACTURE OF SUCH COOLING DEVICES AND COOLING DEVICES MANUFACTURED BY THE METHOD
(FR) PROCEDE POUR PRODUIRE DES ELEMENTS DE REFROIDISSEMENT COMPOSES DE PLUSIEURS PROFILES PARTIELS EN METAL POUR MONTER SUR DES COMPOSANTS A SEMI-CONDUCTEUR, PROFILES POUR PRODUIRE DES ELEMENTS DE REFROIDISSEMENT DE CE TYPE ET ELEMENTS DE REFROIDISSEMENT OBTENUS SELON LEDIT PROCEDE
Abstract
(DE)
Verfahren zur Herstellung von aus mehreren Teilprofilen (1, 2) aus Metall bestehenden Kühlkörpern, bei dem an den Teilprofilen ausgebildete Nuten (112, 122, 212, 232) und Stegleisten (111, 211, 231) jeweils ineinandergesteckt und in Querrichtung durch Druckbeaufschlagung verbunden werden. Dabei werden nach außen abstehende bzw. vorstehende Nutwandungen bzw. Stege (121, 221, 233) eines Teilprofiles (1, 2) in entsprechende Nuten (122, 212, 232) eines benachbarten Teilprofiles (1, 2) nach innen gebogen und/oder mit plastischer Verformung gedrückt zur formschlüssigen Verklammerung der in die zugehörige Nut jeweils eingreifenden Stegleiste.
(EN)
Proposed is a method of manufacturing cooling devices made up of several metal shaped-section elements (1, 2), the method calling for grooves (112, 122, 212, 232) and beads (111, 211, 231) on each of the shaped-section elements to be fitted into each other and connected by the application of pressure in the transverse direction. The outwards-protruding groove walls, designed as beads (121, 223, 233), on one element (1, 2) are pushed into suitably located grooves (122, 212, 232) in a neighbouring section (1, 2), bending inwards and/or deforming plastically, so that each bead entering its associated groove is physically locked in place.
(FR)
L'invention concerne un procédé permettant de produire des éléments de refroidissement composés de plusieurs profilés partiels (1, 2) en métal, selon lequel des rainures (112, 122, 212, 232) et des entretoises (111, 211, 231) formées sur les profilés partiels sont emboîtées les unes dans les autres et reliées dans le sens transversal par application de pression. Les parois (121, 221, 233) des rainures ou des entretoises d'un profilé partiel (1, 2) qui font saillie vers l'extérieur, sont courbées vers l'intérieur dans les rainures (122, 212, 232) correspondantes d'un profilé partiel (1, 2) adjacent et/ou sont comprimées avec déformation plastique en vue d'un assemblage par liaison de forme de l'entretoise entrant dans la rainure qui lui est associée. L'invention concerne également des profilés partiels correspondants et des éléments de refroidissement produits à l'aide dudit procédé.
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