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1. WO1997027051 - METHOD FOR MANUFACTURING LAMINATES

Publication Number WO/1997/027051
Publication Date 31.07.1997
International Application No. PCT/JP1997/000167
International Filing Date 24.01.1997
IPC
H05K 3/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
CPC
B32B 2457/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2457Electrical equipment
08PCBs, i.e. printed circuit boards
B32B 38/0004
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
38Ancillary operations in connection with laminating processes
0004Cutting, tearing or severing, e.g. bursting; Cutter details
H05K 3/022
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Applicants
  • MATSUSHITA ELECTRIC WORKS, LTD. [JP]/[JP] (AllExceptUS)
  • OKAMOTO, Takeshi [JP]/[JP] (UsOnly)
  • KAWAMURA, Kazushi [JP]/[JP] (UsOnly)
  • KUWATA, Toru [JP]/[JP] (UsOnly)
  • TAKANO, Hidekazu [JP]/[JP] (UsOnly)
  • TOMISAKI, Takeshi [JP]/[JP] (UsOnly)
Inventors
  • OKAMOTO, Takeshi
  • KAWAMURA, Kazushi
  • KUWATA, Toru
  • TAKANO, Hidekazu
  • TOMISAKI, Takeshi
Agents
  • TAKAYAMA, Toshio
Priority Data
8/1218426.01.1996JP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR MANUFACTURING LAMINATES
(FR) PROCEDE DE FABRICATION DE STRATIFIES
Abstract
(EN)
A method for manufacturing laminates by forming combined stacks of synthetic resin sheets (1) with continuous sheets (3b, 3c) of metal foil, a laminated block (6) is formed with a plurality of the combined stacks stacked and with insulating interlayers (5) interposed by forming a plurality of the combined stacks in the longitudinal direction of the continuous sheets while folding back the continuous sheets betweent adjacent ones of the combined stacks, and the laminated block (6) is molded under a pressure while suplying an electric current to the continuous metal foil sheets, whereby the respective laminates can be mutually separated without being injured, the separation of the laminates being made quick and easily automated.
(FR)
Ce procédé de fabrication de stratifiés consiste à réaliser des piles combinant des feuilles (1) de résine synthétique et des feuilles (3b, 3c) continues de tôle, à former un bloc stratifié (6) avec plusieurs piles combinées, en plaçant entre celles-ci des couches isolantes (5), cette formation s'effectuant dans le sens longitudinal des feuilles continues, lesquelles sont repliées entre les feuilles adjacentes des piles combinées, puis à mouler le bloc stratifié (6) sous une certaine pression tout en fournissant un courant électrique aux tôles continues, ce qui permet de pouvoir séparer ces stratifiés sans les endommager, cette séparation pouvant ainsi s'effectuer rapidement et être facilement automatisée.
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