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1. WO1997024913 - METHOD OF POSITIONING IC AND IC HANDLER USING THE SAME

Publication Number WO/1997/024913
Publication Date 10.07.1997
International Application No. PCT/JP1996/001455
International Filing Date 29.05.1996
IPC
H01L 21/68 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68for positioning, orientation or alignment
H05K 13/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
02Feeding of components
H05K 13/04 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components
CPC
G01R 31/2887
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2851Testing of integrated circuits [IC]
2886Features relating to contacting the IC under test, e.g. probe heads; chucks
2887involving moving the probe head or the IC under test; docking stations
G01R 31/2891
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2851Testing of integrated circuits [IC]
2886Features relating to contacting the IC under test, e.g. probe heads; chucks
2891related to sensing or controlling of force, position, temperature
H01L 21/68
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
H01L 2924/181
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
181Encapsulation
H05K 13/022
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
02Feeding of components
022with orientation of the elements
H05K 13/0413
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components ; , e.g. of leadless components
0404Pick-and-place heads or apparatus, e.g. with jaws
0413with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
Applicants
  • KABUSHIKI KAISHA SHINANO ELECTRONICS [JP]/[JP] (AllExceptUS)
  • ITO, Masato [JP]/[JP] (UsOnly)
Inventors
  • ITO, Masato
Agents
  • WATANUKI, Takao
Priority Data
7/34034327.12.1995JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD OF POSITIONING IC AND IC HANDLER USING THE SAME
(FR) PROCEDE DE POSTIONNEMENT DE CIRCUITS INTEGRES ET DISPOSITIF MANIPULATEUR DE CIRCUITS INTEGRES FONCTIONNANT SELON CE PROCEDE
Abstract
(EN)
An IC handler (50) employing a method of positioning ICs, in which a vertical movement mechanism (60) is not provided inside a positioning mechanism (10). In the IC handler (50), a positioning wall (72) encompassing a support table (68) includes a lower region (S), in which two pairs of inner surfaces are opposed with a spacing corresponding to the outermost dimensions of the IC (70), and an upper region (T), in which the inner surfaces are extended upward in such a manner that they gradually separate from each other to form slopes (84). A flexible floor member (20) elastically holds the positioning wall (72) movable in the vertical direction. To place an IC (70) on the support table (68), the vertical movement mechanism (60) pushes down the positioning wall (72) from above the positioning mechanism (10) so that the upper surface of the support table (68) is positioned in the upper region (T). The positioning wall is raised after the IC (70) is placed on the support table (68), and the IC (70) is positioned by the vertical surface (82) while its deviation in the horizontal direction is corrected on the slopes (84).
(FR)
L'invention concerne un dispositif manipulateur de circuits intégrés (50) fonctionnant selon un certain procédé de positionnement de circuits intégrés, dispositif dans lequel un mécanisme de déplacement vertical (60) n'est pas monté à l'intérieur d'un mécanisme de positionnement (10). Dans le dispositif manipulateur de circuits intégrés (50), une paroi de positionnement (72) entourant une table de support (68) présente une région inférieure S dans laquelle deux paires de surfaces intérieures sont opposées avec un espacement correspondant aux dimensions extrêmes du circuit intégré (70), ainsi qu'une région supérieure T, dans laquelle les surfaces intérieures s'étendent verticalement de sorte qu'elles se séparent graduellement l'une de l'autre pour former des pentes (84). Un fond flexible (20) soutient élastiquement la paroi de positionnement (72) qui peut se déplacer dans le sens vertical. Pour placer un circuit intégré (70) sur la table de support (68), le mécanisme de déplacement vertical (60) pousse la paroi de positionnement (72) vers le bas, depuis le dessus du mécanisme de positionnement (10), de sorte que la surface supérieure de la table de support (68) soit positionnée dans la région supérieure T. La paroi de positionnement est levée après que le circuit intégré (70) a été placé sur la table de support (68), et le circuit intégré (70) est positionné par la surface verticale (82) tandis que sa déviation dans le sens horizontal est corrigée sur lesdites pentes (84).
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