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1. WO1997023950 - ELECTRONIC COMPONENT, ESPECIALLY ONE OPERATING WITH ACOUSTIC SURFACE WAVES (SW COMPONENT)

Publication Number WO/1997/023950
Publication Date 03.07.1997
International Application No. PCT/DE1996/002409
International Filing Date 16.12.1996
Chapter 2 Demand Filed 26.06.1997
IPC
H03H 9/05 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
02Details
05Holders or supports
H03H 9/10 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
02Details
05Holders or supports
10Mounting in enclosures
CPC
H03H 9/059
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
05Holders; Supports
058for surface acoustic wave devices
059consisting of mounting pads or bumps
Applicants
  • SIEMENS MATSUSHITA COMPONENTS GMBH & CO. KG [DE]/[DE] (AllExceptUS)
  • PAHL, Wolfgang [DE]/[DE] (UsOnly)
  • STELZL, Alois [DE]/[DE] (UsOnly)
  • KRÜGER, Hans [DE]/[DE] (UsOnly)
Inventors
  • PAHL, Wolfgang
  • STELZL, Alois
  • KRÜGER, Hans
Agents
  • EPPING, Wilhelm
Priority Data
195 48 050.321.12.1995DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) ELEKTRONISCHES BAUELEMENT, INSBESONDERE MIT AKUSTISCHEN OBERFLÄCHENWELLEN ARBEITENDES BAUELEMENT - OFW-BAUELEMENT
(EN) ELECTRONIC COMPONENT, ESPECIALLY ONE OPERATING WITH ACOUSTIC SURFACE WAVES (SW COMPONENT)
(FR) COMPOSANT ELECTRONIQUE, NOTAMMENT COMPOSANT FONCTIONNANT A L'AIDE D'ONDES DE SURFACE ACOUSTIQUES (COMPOSANT A ONDES DE SURFACE)
Abstract
(DE)
OFW-Bauelement mit in Flip-Chip-Technik auf einer Leiterplatte (5) montiertem Bauelementesystem (1-3) und mit einem die Bauelementestrukturen (1-3) umgebenden Rahmen (4), bei dem Leiterbahnen (6, 8) auf der Leiterplatte (5) durch diese durchsetzende Durchkontaktierung (9-1, 9-2, 9-3) derart miteinander verbunden sind, daß in Richtung von deren Erstreckung verlaufende Teile (9-1, 9-2) gegeneinander versetzt und über ein Verbindungsstück (9-3) miteinander verbunden sind.
(EN)
An SW component with a component system (1-3) mounted by the flip-chip technique onto a printed circuit board (5) and with a frame (4) surrounding the component structures (1-3), in which conductive tracks (6, 8) are interconnected on the printed circuit board (5) by this through connection (9-1, 9-2, 9-3) in such a way that components (9-1, 9-2) running in the direction of their extension are mutually staggered and interconnected via a connecting member (9-3).
(FR)
L'invention concerne un composant à ondes de surface comportant un système de composants (1-3) monté par bosses soudées sur une carte de circuits (5) et un cadre (4) entourant les structures de composant (1-3). Des tracés conducteurs (6, 8) sont interconnectés sur la carte de circuits (5) par une connexion transversale (9-1, 9-2, 9-3) qui la traverse, de manière que des parties (9-1, 9-2) s'étendant dans le sens de la connexion transversale soient décalées les unes par rapport aux autres et soient interconnectées par une pièce de raccordement (9-3).
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