Processing

Please wait...

Settings

Settings

Goto Application

1. WO1997023904 - PROCESS FOR PRODUCING CONTACTS ON ELECTRICAL COMPONENTS SUITABLE FOR A FLIP-CHIP ASSEMBLY

Publication Number WO/1997/023904
Publication Date 03.07.1997
International Application No. PCT/DE1996/002412
International Filing Date 16.12.1996
Chapter 2 Demand Filed 09.07.1997
IPC
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H03H 3/08 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
08for the manufacture of resonators or networks using surface acoustic waves
CPC
H01L 23/3171
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
3157Partial encapsulation or coating
3171the coating being directly applied to the semiconductor body, e.g. passivation layer
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 2924/3025
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
30Technical effects
301Electrical effects
3025Electromagnetic shielding
H03H 3/08
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
08for the manufacture of resonators or networks using surface acoustic waves
Applicants
  • SIEMENS MATSUSHITA COMPONENTS GMBH & CO. KG [DE]/[DE] (AllExceptUS)
  • PAHL, Wolfgang [DE]/[DE] (UsOnly)
  • STELZL, Alois [DE]/[DE] (UsOnly)
  • KRÜGER, Hans [DE]/[DE] (UsOnly)
Inventors
  • PAHL, Wolfgang
  • STELZL, Alois
  • KRÜGER, Hans
Agents
  • EPPING, Wilhelm
Priority Data
195 48 046.521.12.1995DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUR HERSTELLUNG VON FÜR EINE FLIP- CHIP-MONTAGE GEEIGNETEN KONTAKTEN VON ELEKTRISCHEN BAUELEMENTEN
(EN) PROCESS FOR PRODUCING CONTACTS ON ELECTRICAL COMPONENTS SUITABLE FOR A FLIP-CHIP ASSEMBLY
(FR) PROCEDE DE PRODUCTION DE CONTACTS DE COMPOSANTS ELECTRIQUES, CONVENANT AU MONTAGE PAR BOSSES SOUDEES
Abstract
(DE)
Bei einem Verfahren zur Herstellung von für eine Flip- Chip-Montage geeigneten Kontakten von OFW-Bauelementen, bei denen auf einem Substrat (1) vorgesehene elektrisch leitende Strukturen (3) durch eine Abdeckung (2) verkapselt sind, werden nach Herstellung der Abdeckung (2) mit Pads der elektrisch leitenden Strukturen (3) in Kontakt stehende lötfähige Schichten (4) aufgebracht.
(EN)
In a process for producing contacts on SW components suitable for a flip-chip assembly, in which electrically conductive structures (3) on a substrate (1) are encapsulated by a cover (2), after the cover (2) has been produced, solderable layers (4) in contact with pads of the electrically conductive structures (3) are applied.
(FR)
L'invention concerne un procédé de production de contacts de composants à ondes de surface, convenant au montage par bosses soudées. Des structures électroconductrices (3) prévues sur un substrat (1) sont encapsulées par un élément de protection (2). Une fois cette protection (2) réalisée, des couches (4) brasables mises en contact avec des plages de connexion des structures électroconductrices (3) sont appliquées.
Latest bibliographic data on file with the International Bureau