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1. (WO1997018628) A METHOD OF HERMETICALLY BONDING OXIDE MATERIALS AT RELATIVE LOW TEMPERATURES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/018628 International Application No.: PCT/DK1996/000470
Publication Date: 22.05.1997 International Filing Date: 15.11.1996
Chapter 2 Demand Filed: 16.05.1997
IPC:
H03H 3/08 (2006.01)
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3
Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007
for the manufacture of electromechanical resonators or networks
08
for the manufacture of resonators or networks using surface acoustic waves
Applicants:
THE WHITAKER CORPORATION [US/US]; Suite 450 4550 New Linden Hill Road Wilmington, DE 19808, US (AllExceptUS)
CHRISTENSEN, Frank, K. [DK/DK]; DK (UsOnly)
Inventors:
CHRISTENSEN, Frank, K.; DK
Agent:
CHAS. HUDE A/S; H.C. Andersens Boulevard 33 DK-1553 Copenhagen V, DK
Priority Data:
1280/9516.11.1995DK
Title (EN) A METHOD OF HERMETICALLY BONDING OXIDE MATERIALS AT RELATIVE LOW TEMPERATURES
(FR) PROCEDE PERMETTANT DE COLLER HERMETIQUEMENT DES MATERIAUX OXYDES A DES TEMPERATURES RELATIVEMENT BASSES
Abstract:
(EN) A method of hermetically bonding oxide materials. The bonding is performed by means of an intermediate layer of a commercially available lead borate glass at a temperature below the melting point of aluminium. The method requires no previous surface treatment of structuring of the oxide materials, and electrical feedthroughs can be provided in the same process step as the bonding.
(FR) Procédé permettant de coller hermétiquement des matériaux oxydes, à l'aide d'une couche intermédiaire de verre au borate de plomb disponible dans le commerce, à une température inférieure au point de fusion de l'aluminium. Ledit procédé n'exige pas de traitement de surface préalable ou de structuration des matériaux oxydes et des traversées électriques peuvent être ménagées lors de la même étape que le collage.
Designated States: CN, JP, US
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0861521JP2000500111 CN1202283