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1. (WO1997018606) COOLED LASER DIODE ARRAY ASSEMBLY
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/018606 International Application No.: PCT/FR1996/001772
Publication Date: 22.05.1997 International Filing Date: 08.11.1996
Chapter 2 Demand Filed: 02.06.1997
IPC:
H01S 5/024 (2006.01) ,H01S 5/40 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
024
Cooling arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
40
Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02-H01S5/30128
Applicants:
COMMISSARIAT A L'ENERGIE ATOMIQUE [FR/FR]; 31, rue de la Fédération F-75015 Paris, FR (AllExceptUS)
COMPAGNIE GENERALE DES MATIERES NUCLEAIRES [FR/FR]; 2, rue Paul-Dautier F-78140 Vélizy-Villacoublay, FR (AllExceptUS)
LE GARREC, Bruno [FR/FR]; FR (UsOnly)
RAZE, Gérard [FR/FR]; FR (UsOnly)
Inventors:
LE GARREC, Bruno; FR
RAZE, Gérard; FR
Agent:
BREVATOME; 25, rue de Ponthieu F-75008 Paris, FR
Priority Data:
95/1340013.11.1995FR
Title (EN) COOLED LASER DIODE ARRAY ASSEMBLY
(FR) ASSEMBLAGE DE BARRETTES DE DIODES LASER REFROIDIES
Abstract:
(EN) An assembly of N laser diode arrays (4) is disclosed. Each diode is mounted at the end of a base (6) forming an anode and having a through-hole (10). The through-holes together define a flow channel for a coolant cooling the linear diode array assembly. Each module (20, 22, 24, 26) consisting of an array (4), a base (6) and a corresponding cathode (14) is separated from each immediately adjacent module by a flat gasket (32, 34, 36, 38).
(FR) L'invention concerne un assemblage de N barrettes de diodes laser (4), caractérisé en ce que chaque diode est montée à l'extrémité d'une embase (6) formant anode, traversée par un trou (10), l'ensemble des trous définissant un canal de circulation d'un fluide de refroidissement de l'assemblage linéaire de barrettes de diodes, chaque module (20, 22, 24, 26), constitué d'une barrette (4), de l'embase (6) et d'une cathode (14) correspondantes, étant séparé de chaque module immédiatement voisin par un joint plat (32, 34, 36, 38).
Designated States: JP, US
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: French (FR)
Filing Language: French (FR)
Also published as:
EP0861511US6091746JP2000500291