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1. (WO1997018586) REDUCTION OF ELECTROMAGNETIC INTERFERENCE IN INTEGRATED CIRCUIT DEVICE PACKAGES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/018586 International Application No.: PCT/US1996/017916
Publication Date: 22.05.1997 International Filing Date: 15.11.1996
Chapter 2 Demand Filed: 16.05.1997
IPC:
H01L 23/50 (2006.01) ,H01L 23/552 (2006.01) ,H01L 23/58 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
50
for integrated circuit devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
552
Protection against radiation, e.g. light
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
58
Structural electrical arrangements for semiconductor devices not otherwise provided for
Applicants:
NORAND CORPORATION [US/US]; 550 Second Street, S.E. Cedar Rapids, IA 52401, US (AllExceptUS)
KOENCK, Steven, E. [US/US]; US (UsOnly)
Inventors:
KOENCK, Steven, E.; US
Agent:
BENNETT, James, D.; Stanford & Bennett L.L.P. Bank One Tower 221 West 6th Street Austin, TX 78701, US
Priority Data:
60/006,75515.11.1995US
Title (EN) REDUCTION OF ELECTROMAGNETIC INTERFERENCE IN INTEGRATED CIRCUIT DEVICE PACKAGES
(FR) ATTENUATION DES INTERFERENCES ELECTROMAGNETIQUES DANS DES BOITIERS POUR DISPOSITIFS A CIRCUITS INTEGRES
Abstract:
(EN) EMI radiation in an integrated circuit device package (10) is reduced or eliminated by the introduction of a magnetic material into the encapsulating medium (14). The permeance of the magnetic encapsulating medium (14) affects the inherent series inductance of the lead frame conductors (16) to thereby reduce electromagnetic interference. Ferrite microbeads (30) are formed around the lead frame conductors (16) to contain the magnetic flux (32) generated by an electrical current signal and to attenuate the effects of mutual inductance.
(FR) On réduit ou on élimine le rayonnement des interférences électromagnétiques dans un boîtier (10) pour dispositifs à circuits intégrés en introduisant un matériau magnétique dans le milieu d'encapsulage (14). La perméance du milieu d'encapsulage magnétique (14) affecte l'inductance en série inhérente des conducteurs (16) du cadre de montage de façon à atténuer les interférences électromagnétiques. Des microbilles de ferrite (30) assemblées autour des conducteurs (16) du cadre de montage permettent de contenir le flux magnétique (32) généré par un signal de courant électrique et d'atténuer les effets d'inductance mutuelle.
Designated States: CA, US
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)