Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO1997018254) THERMOSETTING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/018254 International Application No.: PCT/US1996/017499
Publication Date: 22.05.1997 International Filing Date: 30.10.1996
Chapter 2 Demand Filed: 30.05.1997
IPC:
C08G 73/12 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
12
Unsaturated polyimide precursors
Applicants:
CYTEC TECHNOLOGY CORP. [US/US]; Suite 952 1105 North Market Street Wilmington, DE 19801, US
Inventors:
BOYD, Jack; US
KUO, Albert; US
Agent:
NEUMAN, Kristin, H.; Cytec Industries Inc. 1937 West Main Street P.O. Box 60 Stamford, CT 06904-0060, US
Priority Data:
60/006,45213.11.1995US
Title (EN) THERMOSETTING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS
(FR) POLYMERES THERMODURCISSABLES POUR APPLICATIONS COMPOSITES ET ADHESIVES
Abstract:
(EN) Thermosetting polymers with high temperature capability and superior oxidative stability for composite and adhesive applications are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg methods to make polymer matrix, fiber reinforced composite parts.
(FR) Cette invention concerne des polymères thermodurcissables capables de supporter des températures élevées qui présentent une stabilité supérieure vis-à-vis de l'oxydation et sont destinés à des applications composites et adhésives. Ces polymères conviennent parfaitement en tant qu'adhésifs et pour les moulages par transfert de résine (RTM), pour le trempage de films de résine en milieu à température élevée, ainsi que pour des procédés de moulage de pré-imprégnés en vue de la fabrication de pièces composites renforcées par des fibres, à matrice de polymère.
Designated States: CA, JP
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0861281JP2000500794 CA2237359DK0861281