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1. (WO1997017727) A FLIP-CHIP ASSEMBLY
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/017727 International Application No.: PCT/GB1996/002662
Publication Date: 15.05.1997 International Filing Date: 31.10.1996
Chapter 2 Demand Filed: 02.06.1997
IPC:
H01L 21/56 (2006.01) ,H01L 21/60 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
FORD MOTOR COMPANY [US/US]; The American Road Dearborn, MI 48126, US (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, JP, LU, MC, NL, PT, SE)
FORD MOTOR COMPANY LIMITED [GB/GB]; Eagle Way Brentwood Essex CM13 3BW, GB (GB)
FORD MOTOR COMPANY OF CANADA LIMITED [CA/CA]; The Canadian Road Oakville, Ontario L6J 5E4, CA (CA)
Inventors:
BELKE, Robert, Edward; US
WALLES, Bethany; US
TODD, Michael, G.; US
HAYDEN, Brian, J.; US
Agent:
MESSULAM, Alec, Moses; A. Messulam & Co. 24 Broadway Leigh on Sea Essex SS9 1BN, GB
Priority Data:
08/554,18106.11.1995US
Title (EN) A FLIP-CHIP ASSEMBLY
(FR) ENSEMBLE PUCES A BOSSES
Abstract:
(EN) In a method for reversible assembly of a semiconductor electronic flip-chip device (10) to an electrical interconnecting substrate (20), a filled thermoplastic adhesive (16) is interposed between an active face of the flip-chip device (10) and a bond site on the substrate (20). Electrical connection is established between the flip-chip device (10) and the substrate (20) and, generally simultaneously, adhesive bonding between them is established via viscous flow of the filled thermoplastic adhesive (16) above its glass transition temperature, followed by cooling of the adhesive. The adhesive can be reheated to free the flip-chip device of its adhesive bond to the substrate. The filled thermoplastic adhesive (16) includes a low expansion filler in a binder matrix.
(FR) Dans un procédé de montage réversible d'un composant électronique semi-conducteur à puces à bosses (10) sur un substrat d'interconnexion électrique (20), on intercale un adhésif thermoplastique rempli (16) entre une face active du composant à puces à bosses (10) et un emplacement de liaison situé sur le substrat (20). On établit la connexion électrique entre le composant à puces à bosses (10) et le substrat (20) et la liaison adhésive entre eux s'effectue généralement simultanément par l'intermédiaire de l'écoulement visqueux de l'adhésif thermoplastique rempli (16) au-dessus de sa température de transition vitreuse, suivi par le refroidissement de l'adhésif. On peut réchauffer l'adhésif, afin de libérer le composant à puces à bosses de sa liaison au substrat. L'adhésif thermoplastique rempli (16) comprend une charge à faible dilatation dans une matrice liante.
Designated States: CA, JP
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0860023JP2000500921