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1. (WO1997017720) CIRCUIT STRUCTURE HAVING A FLIP-MOUNTED MATRIX OF DEVICES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/017720 International Application No.: PCT/US1996/017357
Publication Date: 15.05.1997 International Filing Date: 25.10.1996
Chapter 2 Demand Filed: 27.05.1997
IPC:
H01L 21/60 (2006.01) ,H03F 3/60 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
F
AMPLIFIERS
3
Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
60
Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators
Applicants:
ENDGATE CORPORATION [US/US]; 321 Soquel Way Sunnyvale, CA 94086-4102, US
Inventors:
MOHWINKEL, Clifford, A.; US
FAULKNER, Mark, Van, Ness; US
Agent:
ANDERSON, Edward, B.; Law Office of Edward B. Anderson P.O. Box 2248 Roseburg, OR 97470-0458, US
Priority Data:
08/555,13108.11.1995US
Title (EN) CIRCUIT STRUCTURE HAVING A FLIP-MOUNTED MATRIX OF DEVICES
(FR) STRUCTURE DE CIRCUIT COMPRENANT UNE MATRICE DE DISPOSITIFS MONTES SUR UNE PUCE A PROTUBERANCES
Abstract:
(EN) A means of connecting a plurality of essentially identical active devices (Q1, Q2, Q3, Q4) is presented for the purpose of multifunction and multiple function operation. These devices (Q1, Q2, Q3, Q4), mounted on a chip (66), are flip-mounted to a circuit motherboard having large passive elements. A push-pull amplifier (50) is presented as an example in which the multiple function operation is the combining of amplifiers (56, 58) whose active devices (Q1, Q2, Q3, Q4) are on a single chip (66). The electromagnetic coupling, impedance matching and signal transmission are variously provided by the use of striplines (82, 88), slotlines (94, 100), coplanar waveguides (116, 130), and a slotline (180) converted into a coplanar waveguide (176, 178).
(FR) Procédé de connexion d'une pluralité de dispositifs actifs très sensiblement identiques (Q1, Q2, Q3, Q4) permettant d'assurer le fonctionnement multifonction et de fonctions multiples. Les dispositifs (Q1, Q2, 3, Q4) montés sur une puce (66) sont montés sans soudure de fils sur une carte mère de circuit comprenant de gros éléments passifs. Un amplificateur push-pull (50) est présenté à titre d'exemple pour illustrer le fait que la mise en oeuvre des fonctions multiples résulte de la combinaison d'amplificateurs (56, 58) dont les dispositifs actifs (Q1, Q2, Q3, Q4) sont situés sur une seule puce (66). Le couplage électromagnétique, l'adaptation d'impédance et la transmission du signal s'effectuent de manière variable au moyen de lignes microruban (82, 88), de lignes microfentes (94, 100), de guides d'ondes coplanaires (116, 130) et d'une ligne microfente (180) transformée en guide d'ondes coplanaire (176, 178).
Designated States: AU, CA, CN, IL, JP
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0860024JP2000515312 AR04149CN1206499CA2236999AU1996075991