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1. (WO1997017396) STYRENE RESIN FOAMING MATERIAL AND HEAT INSULATING MATERIAL USING THE SAME FOR CONSTRUCTION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/017396 International Application No.: PCT/JP1996/003258
Publication Date: 15.05.1997 International Filing Date: 07.11.1996
Chapter 2 Demand Filed: 12.05.1997
IPC:
C08J 9/14 (2006.01) ,C08J 9/18 (2006.01) ,C08J 9/232 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
9
Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
04
using blowing gases generated by a previously added blowing agent
12
by a physical blowing agent
14
organic
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
9
Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
16
Making expandable particles
18
by impregnating polymer particles with the blowing agent
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
9
Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
22
After-treatment of expandable particles; Forming foamed products
228
Forming foamed products
232
by sintering expandable particles
Applicants:
SEKISUI PLASTICS CO., LTD. [JP/JP]; 4-4, Nishitemma 2-chome Kita-ku Osaka-shi Osaka 530, JP (AllExceptUS)
MORIOKA, Ikuo [JP/JP]; JP (UsOnly)
ARAMOMI, Yukio [JP/JP]; JP (UsOnly)
SHIMADA, Mutsuhiko [JP/JP]; JP (UsOnly)
Inventors:
MORIOKA, Ikuo; JP
ARAMOMI, Yukio; JP
SHIMADA, Mutsuhiko; JP
Agent:
KAMEI, Hirokatsu; Ai Association of Patent and Trademark Attorneys Kinyukoko-Sumisei Building 5-20, Minamihommachi 4-chome Chuo-ku, Osaka-shi Osaka 541, JP
Priority Data:
7/29004608.11.1995JP
Title (EN) STYRENE RESIN FOAMING MATERIAL AND HEAT INSULATING MATERIAL USING THE SAME FOR CONSTRUCTION
(FR) MATERIAU DE MOUSSAGE EN RESINE STYRENIQUE ET MATIERE CALORIFUGE CONSTITUEE DE CE MATERIAU POUR LA CONSTRUCTION
Abstract:
(EN) A styrene resin foaming material has a density $g(r) of 0.02-0.008 g/cm3, a melt tension of the styrene resin of 5-40 gf. The relation between an average cell diameter d($g(m)m) and the density $g(r) is given by (1). The relation between a thermal conductivity $g(l)(kcal/m.h. °C) and the density $g(r) is given by (2): $g(l) $m(F) 0.0001 x 1/$g(r) + 0.023. Accordingly, the styrene resin foaming material has a low material conductivity and excellent heat insulating property in spite of a low density (high ratio expansion foam) thereof.
(FR) L'invention concerne un matériau de moussage en résine styrénique ayant une densité $g(r) comprise entre 0.02 et 0.008 g/cm3, la tension de manière fondue de la résine styrénique étant comprise entre 5-40 gf. La relation entre le diamètre moyen d'une cellule d($g(m)m) et la densité $g(r) est donnée par la formule (1). La relation entre la conductivité thermique $g(l)(kcal/m.h. °C) et la densité $g(r) est donnée par la formule (2): $g(l) $m(F) 0.0001 x 1/$g(r) + 0.023. En conséquence, le matériau à moussage en résine styrénique a une faible conductivité et une excellente propriété calorifuge malgré sa faible densité (due à un fort taux de foisonnement de la mousse).
Designated States: CA, CN, JP, KR, NO, US
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
NO19982091EP0860466CN1204354CA2236791KR1019990067402