Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO1997016948) MULTILAYER PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/016948 International Application No.: PCT/JP1996/003100
Publication Date: 09.05.1997 International Filing Date: 24.10.1996
Chapter 2 Demand Filed: 05.05.1997
IPC:
H05K 3/00 (2006.01) ,H05K 3/46 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
SUMITOMO BAKELITE COMPANY LIMITED [JP/JP]; 5-8, Higashishinagawa-2-chome Shinagawa-ku Tokyo 140, JP
Inventors:
HOSOMI, Takeshi; JP
KISHI, Toyoaki; JP
HONJOYA, Tomoyoshi; JP
NAKAMICHI, Sei; JP
MITSUI, Masahiro; JP
Agent:
ASAMURA, Kiyoshi ; New Ohtemachi Building, Room 331 2-1, Ohtemachi 2-chome Chiyoda-ku Tokyo 100, JP
VOSSIUS, Volker; Holbeinstrasse 5 D-81679 München, DE
Priority Data:
7/28422531.10.1995JP
7/28422631.10.1995JP
7/29117009.11.1995JP
7/29117109.11.1995JP
8/21104209.08.1996JP
Title (EN) MULTILAYER PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME
(FR) PLAQUETTE DE CIRCUIT IMPRIME MULTICOUCHE ET SON PROCEDE DE FABRICATION
Abstract:
(EN) A multilayer printed circuit board, characterized by being composed of an internal layer circuit board (1) coated with a light and heat curable undercoating agent (3), a copper foil (5) and an insulating adhesive (4) comprising as the main component a brominated bisphenol type epoxy resin or brominated phenoxy resin having a weight average molecular weight of at least 10,000, the copper foil (5) and the insulating adhesive (4) being laminated to one side or both sides of the internal layer circuit board (1) and being integrally cured with the internal layer circuit board (1) and the undercoating agent (3).
(FR) Plaquette de circuits imprimés multicouche, caractérisée par le fait qu'elle est constituée d'une plaquette de circuit de couche interne (1) revêtue d'un enduit intermédiaire léger et thermodurcissable (3), d'une feuille de cuivre (5) et d'un adhésif d'isolation (4) comprenant comme composant principal une résine époxy ou une résine phénoxy bromurée de type bisphénol bromuré, de poids moléculaire moyen d'au moins 10 000, la feuille de cuivre (5) et l'adhésif d'isolation (4) étant appliqués sur un côté ou sur les deux côtés de la plaquette de circuit de la couche interne (1) et étant durcis solidairement avec la plaquette de circuits de la couche interne (1) et l'enduit intermédiaire (3).
Designated States: CA, CN, KR, MX, SG, VN
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
SG52014VN3229EP0858725CN1201586CA2235819KR1019990067192
VN3229