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1. (WO1997016856) THICK-FILM THERMOELECTRIC ELEMENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/016856 International Application No.: PCT/JP1996/003204
Publication Date: 09.05.1997 International Filing Date: 31.10.1996
IPC:
H01L 35/08 (2006.01) ,H01L 35/32 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
04
Structural details of the junction; Connections of leads
08
non-detachable, e.g. cemented, sintered, soldered
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28
operating with Peltier or Seebeck effect only
32
characterised by the structure or configuration of the cell or thermo-couple forming the device
Applicants:
TECHNOVA INC. [JP/JP]; Fukoku Seimei Building, 13th floor 2-2, Uchisaiwai-cho 2-chome Chiyoda-ku Tokyo 100, JP (AllExceptUS)
AMANO, Takashi [JP/JP]; JP (UsOnly)
KAMIYA, Naoki [JP/JP]; JP (UsOnly)
OKABAYASHI, Makoto [JP/JP]; JP (UsOnly)
Inventors:
AMANO, Takashi; JP
KAMIYA, Naoki; JP
OKABAYASHI, Makoto; JP
Agent:
OHKAWA, Hiroshi; 2-5, Meieki 3-chome Nakamura-ku Nagoya-shi Aichi-ken 450, JP
Priority Data:
7/28297131.10.1995JP
8/27670418.10.1996JP
Title (EN) THICK-FILM THERMOELECTRIC ELEMENT
(FR) THERMOCOUPLE A FILM EPAIS
Abstract:
(EN) A thick-film thermoelectric element which is durable, inexpensive, well responsive to heat, and capable of producing relatively large electric power. The thermoelectric element comprises a substrate of 2 mm or thinner and a thermoelectric thick film of 0.01-1.0 in thickness on the substrate. The thermoelectric thick film is coated with a vitreous film, which prevents the separation of the thermoelectric film from the substrate and the oxidation and deterioration of the thermoelectric film.
(FR) La présente invention concerne un thermocouple à film épais qui est durable et peu coûteux, réagit bien à la chaleur et est capable de produire une puissance électrique relativement importante. Ce thermocouple comprend un substrat de 2 mm ou moins et un film épais thermoélectrique de 0,01 à 1,0 mm d'épaisseur, placé sur le substrat. Ce film épais thermoélectrique est recouvert d'un film vitreux qui l'empêche de se séparer du substrat et empêche aussi son oxydation et sa détérioration.
Designated States: US
European Patent Office (DE, GB)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP0801428US5864087