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1. (WO1997016849) BALL GRID ARRAY INTEGRATED CIRCUIT SOCKET
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/016849 International Application No.: PCT/US1996/015045
Publication Date: 09.05.1997 International Filing Date: 19.09.1996
IPC:
G01R 1/04 (2006.01) ,H01R 4/02 (2006.01) ,H05K 7/10 (2006.01)
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
04
Housings; Supporting members; Arrangements of terminals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
02
Soldered or welded connections
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
02
Arrangements of circuit components or wiring on supporting structure
10
Plug-in assemblages of components
Applicants:
MINNESOTA MINING AND MANUFACTURING COMPANY [US/US]; 3M Center P.O. Box 33427 Saint Paul, MN 55133-3427, US
Inventors:
CEARLEY-CABBINESS, Carol, L.; US
BURG, John, S.; US
HARDCASTLE, David, S.; US
PETERSEN, Kurt, H.; US
SCHUELLER, Gayle, R., T.; US
Agent:
MCNUTT, Matthew, B.; Minnesota Mining and Manufacturing Company Office of Intellectual Property Counsel P.O. Box 33427 Saint Paul, MN 55133-3427, US
Priority Data:
08/552,00402.11.1995US
Title (EN) BALL GRID ARRAY INTEGRATED CIRCUIT SOCKET
(FR) PRISE FEMELLE DE CIRCUIT INTEGRE A ENSEMBLE EN GRILLE COMPOSE DE GLOBULES
Abstract:
(EN) A socket for an integrated circuit device is provided which includes solder ball projections for surface-mount attachment to a circuit board. The socket includes a circuit board having conductive pads to which terminations of the integrated circuit device connect. The conductive pads are then connected to the solder balls either directly or through circuitry on the circuit board.
(FR) Cette prise femelle de circuit intégré comprend des projections de globules de soudure destinées à la fixation par montage en surface sur une plaquette de circuit. Cette prise comprend une plaquette de circuit à plages conductrices auxquelles sont connectées des extrémités de connexion du circuit intégré. Ces plages conductrices sont elles-mêmes connectées aux globules de soudure soit directement soit par des circuits disposés sur la plaquette de circuit.
Designated States: JP, KR, SG
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)