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1. (WO1997016848) ELECTRONIC PART MODULE AND PROCESS FOR MANUFACTURING THE SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/016848 International Application No.: PCT/JP1996/003153
Publication Date: 09.05.1997 International Filing Date: 28.10.1996
Chapter 2 Demand Filed: 30.05.1997
IPC:
H01L 21/56 (2006.01) ,H05K 3/30 (2006.01) ,H05K 3/34 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
IBIDEN CO., LTD. [JP/JP]; 1, Kanda-cho 2-chome Ogaki-shi Gifu-ken 503, JP (AllExceptUS)
MORI, Mikio [JP/JP]; JP (UsOnly)
KOHMURA, Toshimi [JP/JP]; JP (UsOnly)
Inventors:
MORI, Mikio; JP
KOHMURA, Toshimi; JP
Priority Data:
7/30832731.10.1995JP
Title (EN) ELECTRONIC PART MODULE AND PROCESS FOR MANUFACTURING THE SAME
(FR) MODULE DE COMPOSANT ELECTRONIQUE ET SON PROCEDE DE FABRICATION
Abstract:
(EN) An electronic part module which is reduced in cost by using an inexpensive thermoplastic resin as the base material of a circuit board. In order to electrically connect the solder bumps of an electronic part such as an IC chip to a connection pattern, the electronic part is heated and then pressed against the circuit board. Then the board is partially fused and the bumps penetrate through the board, even though no connection holes are made in advance. The material of the board also serves as adhesive. Heating the electronic part (3) to a temperature higher than the fusing temperature of the thermoplastic resin and lower than the melting point of the bumps (2), the bumps (2) are pressed against the resin board (4). The solder bumps (2) penetrate through the base material (4) and come into contact with a connection pattern (5). Next the parts (3) are further heated to a temperature higher than the melting point of the bumps (2), and then the bumps are fused and welded to the connection pattern. Therefore, the part (3) is bonded and fixed to the pattern through the thermoplastic resin of the base material (4) around the bumps (2).
(FR) L'invention concerne un module de composant électronique dont on peut réduire le coût de fabrication en utilisant une résine thermoplastique bon marché comme matériau de base d'une carte imprimée. Pour assurer la connexion électrique des bosses de soudure d'un composant électronique tel qu'une puce de circuit imprimé à un motif de connexion, on chauffe le composant électronique et on le comprime contre la carte imprimée. On fait partiellement fondre la carte si bien que les bosses pénètrent dans celle-ci même si aucun orifice de connexion n'a été réalisé à l'avance. Le matériau constituant la carte sert également d'adhésif. On porte le composant électronique (3) à une température supérieure à la température de fusion de la résine thermoplastique et inférieure au point de fusion des bosses (2), lesquelles sont comprimées contre la carte en résine (4). Les bosses de soudure (2) pénètrent dans le matériau de base (4) et viennent en contact avec le motif de connexion (5). On porte ensuite les composants (3) à une température supérieure au point de fusion des bosses (2), après quoi on fait fondre ces dernières et on les soude au motif de connexion. Ainsi, on soude et on fixe le composant (3) au motif au moyen de la résine thermoplastique du matériau de base (4) situé autour des bosses (2).
Designated States: CA, CN, JP, KR, US
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US6303873JP3544990