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1. (WO1997016470) PHOTOSENSITIVE RESIN COMPOSITION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/016470 International Application No.: PCT/JP1996/003173
Publication Date: 09.05.1997 International Filing Date: 30.10.1996
Chapter 2 Demand Filed: 25.04.1997
IPC:
C08F 290/06 (2006.01) ,C08G 59/42 (2006.01) ,G03F 7/032 (2006.01) ,G03F 7/038 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290
Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02
on to polymers modified by introduction of unsaturated end groups
06
Polymers provided for in subclass C08G52
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
42
Polycarboxylic acids; Anhydrides, halides, or low-molecular-weight esters thereof
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032
with binders
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
038
Macromolecular compounds which are rendered insoluble or differentially wettable
Applicants:
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION [US/US]; 501 Silverside Road Wilmington Delaware 19809, US (AllExceptUS)
NISHIKAWA, Katsue [JP/JP]; JP (UsOnly)
KINASHI, Keiichi [JP/JP]; JP (UsOnly)
CHIBA, Reiko [JP/JP]; JP (UsOnly)
HAGIWARA, Youshichi [JP/JP]; JP (UsOnly)
Inventors:
NISHIKAWA, Katsue; JP
KINASHI, Keiichi; JP
CHIBA, Reiko; JP
HAGIWARA, Youshichi; JP
Agent:
HOSOKAWA, Shinya; Yuasa and Hara Section 206, New Ohtemachi Building 2-1, Ohtemachi 2-chome Chiyoda-ku Tokyo 100, JP
Priority Data:
7/28210630.10.1995JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION
(FR) COMPOSITION DE RESINE PHOTOSENSIBLE
Abstract:
(EN) The photosensitive resin composition of the present invention uses, as the characteristic feature, a modified epoxy resin product obtained by reacting a novolak epoxy resin with an unsaturated monocarboxylic acid in an amount of 30 to 70 % by mol per equivalent of the epoxy group in the novolak epoxy resin in the presence of a trivalent organic phosphorus compound as the catalyst; deactivating the catalytic action of the organic phosphorus compound; and then reacting the resulting reaction product with a polycarboxylic acid anhydride in an amount of 10 to 70 % by mol per equivalent of the epoxy group in the starting novolak epoxy resin and the modified epoxy resin product having an epoxy group, an unsaturated group and a carboxyl group at a mol ratio of the epoxy group: the unsaturated group: the carboxyl group in the molecule being 30$m(k)70 : 30$m(k)70 : 10$m(k)70, as the base resin.
(FR) L'invention concerne une composition de résine photosensible caractérisée en ce qu'elle contient un produit de résine époxyde modifiée produit par mise en réaction d'une résine époxyde novolaque comprenant de l'acide monocarboxylique à raison de 30 à 70 % en mole par équivalent du groupe époxy, en présence d'un composé phosphoreux organique trivalent faisant office de catalyseur; par désactivation de l'action catalytique du composé phosphoreux organique; et par mise en réaction du produit de réaction résultant avec un anhydride d'acide polycarboxylique à raison de 10 à 70 % en mole par équivalent du groupe époxyde dans le résine époxyde novolaque de départ et le produit de résine époxyde modifiée comprenant un groupe époxyde, un groupe insaturé et un groupe carboxyle selon un rapport en mole entre le groupe époxyde: le groupe insaturé: le groupe carboxylique dans la molécule de 30$m(k)70 : 30$m(k)70 : 10$m(k)70, en tant que résine de base.
Designated States: AL, AM, AU, AZ, BA, BB, BG, BR, BY, CA, CN, CU, CZ, EE, GE, HU, IL, IS, KE, KG, KR, KZ, LC, LK, LR, LS, LT, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, RO, RU, SD, SG, SI, SK, TJ, TM, TR, TT, UA, UG, US, UZ, VN
African Regional Intellectual Property Organization (ARIPO) (KE, LS, MW, SD, SZ, UG)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0858472CA2234110AU1996073383