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1. (WO1997016056) RESIN FILLER AND MULTILAYER PRINTED WIRING BOARD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/016056 International Application No.: PCT/JP1996/003088
Publication Date: 01.05.1997 International Filing Date: 23.10.1996
IPC:
H05K 3/00 (2006.01) ,H05K 3/38 (2006.01) ,H05K 3/46 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
38
Improvement of the adhesion between the insulating substrate and the metal
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
IBIDEN CO., LTD. [JP/JP]; 1, Kanda-cho 2-chome Ogaki-shi Gifu 503, JP
Inventors:
KAWAMURA, Yoichiro; JP
MURASE, Hideki; JP
ASAI, Motoo; JP
Agent:
OGAWA, Junzo; Kobikikan Ginza Building 8-9, Ginza 2-chome Chuo-ku Tokyo 104, JP
Priority Data:
7/27392823.10.1995JP
7/31746910.11.1995JP
8/16340224.06.1996JP
Title (EN) RESIN FILLER AND MULTILAYER PRINTED WIRING BOARD
(FR) RESINE DE REMPLISSAGE ET CARTE DE CIRCUITS IMPRIMES MULTICOUCHE
Abstract:
(EN) A resin filler preferably packed in recesses occurring in the surface of a wiring board or in through holes provided therein, and a structure of a highly reliable built-up multilayer printed wiring board filled with the same resin filler are proposed. This resin filler is a solventless resin filler to be packed in the recesses occurring in the surface of a wiring board or in the through holes provided therein, the resin filler being characterized in that the filler contains resin components of bisphenol type epoxy resin and a curing agent of imidazole, and an additive component of inorganic particles as necessary. A built-up multilayer printed wiring board using this resin filler is also proposed.
(FR) L'invention porte sur une résine de remplissage utilisée de préférence pour remplir les cavités se présentant à la surface d'une carte de circuits imprimés ou les trous traversants, et sur une structure de carte de circuits imprimés multicouche hautement fiable intégrée dont les cavités et trous sont remplis à l'aide de ladite résine. Cette résine sans solvant se caractérise en ce qu'elle est constituée de résine époxyde biphénolique, d'un durcisseur d'imidazole, et d'un additif éventuel comprenant des particules inorganiques. L'invention porte également sur une carte de circuits imprimés multicouche intégrée utilisant ladite résine.
Designated States: CN, KR
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP0800336EP1318708EP1445996EP1705973JP9181415 JP10075027
JP2000269620 JP2000357850 JP2003332737 CN1169234CN1549673CN1917738
DE000069633381DE000069633690KR1019987001202