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1. WO1997016056 - RESIN FILLER AND MULTILAYER PRINTED WIRING BOARD

Publication Number WO/1997/016056
Publication Date 01.05.1997
International Application No. PCT/JP1996/003088
International Filing Date 23.10.1996
IPC
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H05K 3/38 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
H05K 3/46 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
CPC
H05K 2201/0129
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0104Properties and characteristics in general
0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
H05K 2201/0195
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0183Dielectric layers
0195Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
H05K 2201/0209
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
02Fillers; Particles; Fibers; Reinforcement materials
0203Fillers and particles
0206Materials
0209Inorganic, non-metallic particles
H05K 2201/0212
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
02Fillers; Particles; Fibers; Reinforcement materials
0203Fillers and particles
0206Materials
0212Resin particles
H05K 2201/0347
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0335Layered conductors or foils
0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
H05K 2201/09536
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09536Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
Applicants
  • IBIDEN CO., LTD. [JP]/[JP]
Inventors
  • KAWAMURA, Yoichiro
  • MURASE, Hideki
  • ASAI, Motoo
Agents
  • OGAWA, Junzo
Priority Data
7/27392823.10.1995JP
7/31746910.11.1995JP
8/16340224.06.1996JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN FILLER AND MULTILAYER PRINTED WIRING BOARD
(FR) RESINE DE REMPLISSAGE ET CARTE DE CIRCUITS IMPRIMES MULTICOUCHE
Abstract
(EN)
A resin filler preferably packed in recesses occurring in the surface of a wiring board or in through holes provided therein, and a structure of a highly reliable built-up multilayer printed wiring board filled with the same resin filler are proposed. This resin filler is a solventless resin filler to be packed in the recesses occurring in the surface of a wiring board or in the through holes provided therein, the resin filler being characterized in that the filler contains resin components of bisphenol type epoxy resin and a curing agent of imidazole, and an additive component of inorganic particles as necessary. A built-up multilayer printed wiring board using this resin filler is also proposed.
(FR)
L'invention porte sur une résine de remplissage utilisée de préférence pour remplir les cavités se présentant à la surface d'une carte de circuits imprimés ou les trous traversants, et sur une structure de carte de circuits imprimés multicouche hautement fiable intégrée dont les cavités et trous sont remplis à l'aide de ladite résine. Cette résine sans solvant se caractérise en ce qu'elle est constituée de résine époxyde biphénolique, d'un durcisseur d'imidazole, et d'un additif éventuel comprenant des particules inorganiques. L'invention porte également sur une carte de circuits imprimés multicouche intégrée utilisant ladite résine.
Also published as
Latest bibliographic data on file with the International Bureau