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1. (WO1997016055) METHOD FOR DEPOSITING A PROTECTIVE COATING ON THE COMPONENTS OF AN ELECTRONIC BOARD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/016055 International Application No.: PCT/FR1996/001630
Publication Date: 01.05.1997 International Filing Date: 18.10.1996
IPC:
B05D 1/34 (2006.01) ,H05K 3/28 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
1
Processes for applying liquids or other fluent materials
34
Applying different liquids or other fluent materials simultaneously
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants:
GIAT INDUSTRIES [FR/FR]; 13, route de la Minière F-78000 Versailles, FR (AllExceptUS)
DESSAUX, Christophe [FR/FR]; FR (UsOnly)
MOREAU, Emmanuel [FR/FR]; FR (UsOnly)
Inventors:
DESSAUX, Christophe; FR
MOREAU, Emmanuel; FR
Agent:
CELANIE, Christian; Giat Industries 13, route de la Minière F-78034 Versailles Cédex, FR
Priority Data:
95/1259525.10.1995FR
Title (EN) METHOD FOR DEPOSITING A PROTECTIVE COATING ON THE COMPONENTS OF AN ELECTRONIC BOARD
(FR) PROCEDE POUR DEPOSER UN REVETEMENT DE PROTECTION SUR LES COMPOSANTS D'UNE CARTE ELECTRONIQUE
Abstract:
(EN) A method for depositing a protective coating consisting of a polymerisable material such as a resin on the components of an electronic board, wherein the coating material is prepared from a starting mixture of at least two materials (A, B) and a variable amount of a third material (C) is added to the starting mixture in order to vary the viscosity thereof according to the type of component to be protected during the process of coating the components (P1, P2, P3) of the electronic board (CE).
(FR) Procédé pour déposer un revêtement de protection sur les composants d'une carte électronique, le revêtement étant constitué par un matériau polymérisable tel qu'une résine, caractérisé en ce qu'il consiste à préparer le matériau constituant le revêtement à partir d'un mélange initial d'au moins deux constituants (A, B), et à ajouter à ce mélange initial au moins un troisième constituant (C) en quantité variable de manière à faire varier la viscosité du mélange initial suivant le type de composant à protéger pendant l'opération d'enrobage des composants (P1, P2, P3) de la carte électronique (CE).
Designated States: CA, US
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: French (FR)
Filing Language: French (FR)
Also published as:
ES2155944EP0799558US5897913CA2203034DE000069612082FR2740608