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1. (WO1997015894) CARRIER ELEMENT FOR USE IN A CHIP CARD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1997/015894 International Application No.: PCT/DE1996/001946
Publication Date: 01.05.1997 International Filing Date: 11.10.1996
Chapter 2 Demand Filed: 13.05.1997
IPC:
G06K 19/077 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
077
Constructional details, e.g. mounting of circuits in the carrier
Applicants:
SIEMENS AKTIENGESELLSCHAFT [DE/DE]; Wittelsbacherplatz 2 D-80333 München, DE (AllExceptUS)
FRIES, Manfred [DE/DE]; DE (UsOnly)
KIRSCHBAUER, Josef [DE/DE]; DE (UsOnly)
HOUDEAU, Detlef [DE/DE]; DE (UsOnly)
Inventors:
FRIES, Manfred; DE
KIRSCHBAUER, Josef; DE
HOUDEAU, Detlef; DE
Priority Data:
195 38 233.113.10.1995DE
Title (DE) TRÄGERELEMENT ZUM EINBAU IN EINE CHIPKARTE
(EN) CARRIER ELEMENT FOR USE IN A CHIP CARD
(FR) ELEMENT DE SUPPORT A MONTER DANS UNE CARTE A PUCE
Abstract:
(DE) Trägerelement zum Einbau in eine Chipkarte mit einer Trägerfolie (1), auf der eine Spule (2) und ein mit dieser verbundener Halbleiterchip angeordnet ist, wobei die Trägerfolie (1), innerhalb und außerhalb des die Spule (2) aufweisenden Bereichs Ausnehmungen (5, 6) aufweist.
(EN) A carrier element for use in a chip card has a carrier foil (1) on which are arranged a coil (2) and a semiconductor chip connected thereto. The carrier foil (1) has recesses (5, 6) in and outside the area of the coil (2).
(FR) Cet élément de support à monter dans une carte à puce comprend une feuille de support (1) sur laquelle sont montées une bobine (2) et une puce de semiconducteur connectée à la bobine. La feuille de support (1) est pourvue d'évidements à l'intérieur et à l'extérieur de la zone de la bobine (2).
Designated States: CN, JP, KR, RU, UA, US
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: German (DE)
Filing Language: German (DE)