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1. WO1997014280 - LAMINATES HAVING IMPROVED DIELECTRIC PROPERTIES

Publication Number WO/1997/014280
Publication Date 17.04.1997
International Application No. PCT/US1996/016400
International Filing Date 10.10.1996
Chapter 2 Demand Filed 28.04.1997
IPC
B32B 5/28 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
5Layered products characterised by the non-homogeneity or physical structure of a layer
22characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous
24one layer being a fibrous or filamentary layer
28impregnated with or embedded in a plastic substance
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
CPC
B32B 5/28
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
5Layered products characterised by the non- homogeneity or physical structure ; , i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
22characterised by the presence of two or more layers which ; are next to each other and are fibrous, filamentary, formed of particles or foamed
24one layer being a fibrous or filamentary layer
28impregnated with or embedded in a plastic substance
H05K 1/036
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
0353consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
036Multilayers with layers of different types
H05K 1/0366
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
0353consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
0366reinforced, e.g. by fibres, fabrics
H05K 1/0373
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
0353consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
0373containing additives, e.g. fillers
H05K 2201/0209
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
02Fillers; Particles; Fibers; Reinforcement materials
0203Fillers and particles
0206Materials
0209Inorganic, non-metallic particles
H05K 2201/0212
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
02Fillers; Particles; Fibers; Reinforcement materials
0203Fillers and particles
0206Materials
0212Resin particles
Applicants
  • ALLIEDSIGNAL INC. [US]/[US]
Inventors
  • CHU, Cheng-wu
  • HOLTE, Mark, D.
Agents
  • CRISS, Roger, H.
  • KAPPES, Kyle
Priority Data
08/544,41810.10.1995US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) LAMINATES HAVING IMPROVED DIELECTRIC PROPERTIES
(FR) PLAQUETTES POUR CIRCUIT IMPRIME A CARACTERISTIQUES DIELECTRIQUES AMELIOREES
Abstract
(EN)
Printed circuit boards comprise laminates, e.g. CEM-3 laminates, having insulating substrates which include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 $g(m)m, which reduce the dielectric constant and dissipation factor of such laminates. Comparative Tracking Index (CTI) is significantly improved.
(FR)
Les circuits imprimés sont constitués de plaquettes qui, comme les plaquettes CEM-3, comportent des substrats isolants renfermant des particules polymères, notamment des particules à noyau et enveloppe d'un calibre moyen situé entre environ 0,05 et 30 microns, ce qui atténue la constante diélectrique et le facteur de dissipation de ces plaquettes. L'indice comparatif d'alignement se trouve sensiblement amélioré.
Also published as
Latest bibliographic data on file with the International Bureau