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1. (WO1997014164) SWITCH
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1997/014164    International Application No.:    PCT/JP1996/002972
Publication Date: 17.04.1997 International Filing Date: 11.10.1996
Chapter 2 Demand Filed:    06.03.1997    
H01H 1/023 (2006.01)
Applicants: OMRON CORPORATION [JP/JP]; 10, Tsuchido-cho, Hanazono, Ukyo-ku, Kyoto-shi, Kyoto 616 (JP) (For All Designated States Except US).
YAMAMOTO, Wataru [JP/JP]; (JP) (For US Only).
KITAGAWA, Masatoshi [JP/JP]; (JP) (For US Only).
OTA, Masahiko [JP/JP]; (JP) (For US Only).
MORI, Tetsuya [JP/JP]; (JP) (For US Only).
DAIKOKU, Masato [JP/JP]; (JP) (For US Only).
UENO, Nobuaki [JP/JP]; (JP) (For US Only).
HASHIZUME, Shinichi [JP/JP]; (JP) (For US Only).
NIWA, Takashi [JP/JP]; (JP) (For US Only).
KISHI, Shigenobu [JP/JP]; (JP) (For US Only).
TAKAMI, Koji [JP/JP]; (JP) (For US Only)
Inventors: YAMAMOTO, Wataru; (JP).
KITAGAWA, Masatoshi; (JP).
OTA, Masahiko; (JP).
MORI, Tetsuya; (JP).
DAIKOKU, Masato; (JP).
UENO, Nobuaki; (JP).
HASHIZUME, Shinichi; (JP).
NIWA, Takashi; (JP).
KISHI, Shigenobu; (JP).
TAKAMI, Koji; (JP)
Agent: FUKAMI, Hisao; Sumitomo Bank Minamimori-machi Building, 1-29, Minamimori-machi 2-chome, Kita-ku, Osaka-shi, Osaka 530 (JP)
Priority Data:
7/291914 12.10.1995 JP
Abstract: front page image
(EN)A switch is provided with a snap-action contact mechanism (10) which brings a movable contact (7) into contact with fixed contacts (5) and (6) and separates the contact (7) from the contacts (5) and (6) through snapping actions. Each contact is formed of a contact material containing 2.0-5.0 wt.% of tin, 5.0-8.0 wt.% of indium, and less than 0.5 wt.% of an iron family metal, and the balance silver.
(FR)Cette invention concerne un commutateur à mécanisme de contact par déclic (10), lequel mécanisme permet de mettre un contact mobile (7) en contact avec des contacts fixes (5 et 6) ou de séparer le contact mobile (7) desdits contact fixes (5 et 6) par déclic. Chaque contact est fait d'un matériau de contact contenant de 2,0 à 5,0 % en poids d'étain, de 5,0 à 8,0 % en poids d'indium, et moins de 0,5 % en poids d'un métal de la famille du fer, le reste se composant d'argent.
Designated States: CN, KR, US.
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)