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Machine translation
1. (WO1997013590) METHOD AND APPARATUS FOR CHEMICAL DELIVERY THROUGH THE BRUSH
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1997/013590    International Application No.:    PCT/US1996/016330
Publication Date: 17.04.1997 International Filing Date: 11.10.1996
Chapter 2 Demand Filed:    12.05.1997    
IPC:
A46B 11/06 (2006.01), B08B 1/04 (2006.01), B08B 3/08 (2006.01), H01L 21/00 (2006.01), H01L 21/306 (2006.01), H01L 21/311 (2006.01)
Applicants: ONTRAK SYSTEMS, INC. [US/US]; 1010 Rincon Circle, San Jose, CA 95131 (US) (For All Designated States Except US).
DELARIOS, John, M. [US/US]; (US) (For US Only).
RAVKIN, Mikhail [--/US]; (US) (For US Only).
GARDNER, Douglas, G. [US/US]; (US) (For US Only)
Inventors: DELARIOS, John, M.; (US).
RAVKIN, Mikhail; (US).
GARDNER, Douglas, G.; (US)
Agent: MALLIE, Michael, J.; Blakely, Sokoloff, Taylor & Zafman, 7th floor, 12400 Wilshire Boulevard, Los Angeles, CA 90025 (US)
Priority Data:
08/542,531 13.10.1995 US
Title (EN) METHOD AND APPARATUS FOR CHEMICAL DELIVERY THROUGH THE BRUSH
(FR) PROCEDE ET APPAREIL DE DISTRIBUTION DE PRODUITS CHIMIQUES A TRAVERS UNE BROSSE
Abstract: front page image
(EN)A method and apparatus for chemical delivery through the brush (240) used in semiconductor substrate cleaning processes. The chemical solutions (210, 220) are delivered to the core (230) of a brush (240) where the solution is absorbed by the brush (240) and then applied by the brush (240) onto the substrate. This delivery system applies the chemical solutions (210, 220) uniformly to the semiconductor substrate, reduces the volumes of chemical solutions (210, 220) used in a scrubbing process, and helps maintain control of the pH profile of a subtrate. This system is described and illustrated in the manner it is used in conjunction with a scrubber that scrubs both sides of a semiconductor substrate.
(FR)L'invention porte sur un procédé et un appareil servant à distribuer des produits chimiques à l'aide d'une brosse (240) servant au nettoyage du substrat de semi-conducteurs. La solution chimique (210, 220) distribuée au centre (230) de la brosse (240) y est absorbée puis déposée par la brosse (240) sur le substrat. Ce système de distribution permet une répartition homogène de la solution (210, 220) sur le substrat du semi-conducteur, réduit le volume de solution (210, 220) consommée pendant le processus de lavage et contribue à conserver le contrôle du profil pH du substrat. Son mode d'utilisation est décrit et illustré en association avec une brosse qui nettoie les deux côtés du substrat du semi-conducteur.
Designated States: AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GE, HU, IL, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, TJ, TM, TR, TT, UA, UG, US, UZ, VN.
African Regional Intellectual Property Organization (KE, LS, MW, SD, SZ, UG)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)