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1. WO1997013271 - A METHOD OF ACCURATE COMPOSITIONAL ANALYSIS OF DIELECTRIC FILMS ON SEMICONDUCTORS

Publication Number WO/1997/013271
Publication Date 10.04.1997
International Application No. PCT/US1996/013864
International Filing Date 30.08.1996
Chapter 2 Demand Filed 02.05.1997
IPC
H01L 21/66 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
CPC
H01L 22/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
22Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
10Measuring as part of the manufacturing process
12for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Applicants
  • ADVANCED MICRO DEVICES, INC. [US]/[US]
Inventors
  • ROMERO, Jeremias, D.
  • ALVIS, Roger, L.
  • FATEMI, Homi
Agents
  • RODDY, Richard, J.
  • BROOKES & MARTIN
Priority Data
08/539,02904.10.1995US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) A METHOD OF ACCURATE COMPOSITIONAL ANALYSIS OF DIELECTRIC FILMS ON SEMICONDUCTORS
(FR) PROCEDE POUR ANALYSER AVEC PRECISION LA COMPOSITION DES COUCHES DIELECTRIQUES DES SEMI-CONDUCTEURS
Abstract
(EN)
A method of accurately determining the composition of a dielectric film in a semiconductor device by performing a compositional analysis on a film only portion of the semiconductor device.
(FR)
Procédé permettant d'analyser avec précision la composition de la couche diélectrique d'un dispositif semi-conducteur en analysant la composition d'une partie couche uniquement du dispositif.
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