Search International and National Patent Collections

1. (WO1997012270) SURFACE MOUNT MODULE AND PRODUCTION METHOD THEREOF

Pub. No.:    WO/1997/012270    International Application No.:    PCT/JP1996/002768
Publication Date: Apr 3, 1997 International Filing Date: Sep 25, 1996
IPC: G02B 6/36
G02B 6/42
Applicants: THE FURUKAWA ELECTRIC CO., LTD.

OISHI, Isamu

Inventors: OISHI, Isamu

Title: SURFACE MOUNT MODULE AND PRODUCTION METHOD THEREOF
Abstract:
A surface mount module (1) comprising an optical semiconductor device (5) and an optical fiber (6) on a substrate (2), and a production method of the module (1). The substrate (2) comprises a base (3) formed by a precision transfer technique and having positioning marks (3b) for the optical semiconductor device and a positioning portion (3c) for the optical fiber; and a molded article (4) integrated with the base.