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1. (WO1997007924) REFLOW SOLDERING APPARATUS WITH A ROTATIVE CONFIGURATION

Pub. No.:    WO/1997/007924    International Application No.:    PCT/NL1996/000341
Publication Date: Mar 6, 1997 International Filing Date: Aug 28, 1996
IPC: B23K 3/04
Applicants: SOLTEC B.V.
SCHMITS, Jeroen, Lambertus
DEN DOPPER, Rolf, Arthur
Inventors: SCHMITS, Jeroen, Lambertus
DEN DOPPER, Rolf, Arthur
Title: REFLOW SOLDERING APPARATUS WITH A ROTATIVE CONFIGURATION
Abstract:
The invention relates to an apparatus for subjecting objects to processes, wherein the apparatus comprises: a plurality of chambers which are each adapted to contain at least one object; and processing devices for processing objects present in the chambers, wherein the chambers are adapted to successively perform different processes on the object present in the chamber. According to a first embodiment the chambers are moveable in accordance with a closed circuit and the processing devices are adapted to perform a process on the object which is present in a chamber present in a defined position. According to a second embodiment the chambers are arranged fixedly and transporting means are arranged to carry the objects for processing and the processed objects in and out of the chambers.