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1. WO1996042110 - SEMICONDUCTOR DEVICE

Publication Number WO/1996/042110
Publication Date 27.12.1996
International Application No. PCT/JP1996/001444
International Filing Date 29.05.1996
Chapter 2 Demand Filed 28.08.1996
IPC
H01L 23/522 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/64 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
CPC
H01L 2224/05554
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
0554External layer
0555Shape
05552in top view
05554being square
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/49171
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
491Disposition
4912Layout
49171Fan-out arrangements
H01L 23/5227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
5227Inductive arrangements or effects of, or between, wiring layers
H01L 23/645
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for ; , e.g. in combination with batteries
64Impedance arrangements
645Inductive arrangements
H01L 24/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
Applicants
  • NIIGATA SEIMITSU CO., LTD. [JP]/[JP] (AllExceptUS)
  • IKEDA, Takeshi [JP]/[JP] (UsOnly)
  • NAKANISHI, Tsutomu [JP]/[JP] (UsOnly)
  • OKAMOTO, Akira [JP]/[JP] (UsOnly)
Inventors
  • IKEDA, Takeshi
  • NAKANISHI, Tsutomu
  • OKAMOTO, Akira
Agents
  • AMAGAI, Masahiko
Priority Data
7/20683708.06.1995JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEMICONDUCTOR DEVICE
(FR) DISPOSITIF A SEMI-CONDUCTEURS
Abstract
(EN)
An integrated circuit is formed on a chip (10), and a plurality of bonding pads (12) are disposed on the outside of the chip (10). The bonding pads (12) are connected through bonding wires (18) with terminals (16) of the package of the chip (10). A conductor is formed on the chip surface between the bonding pads (12) and the side edges of the chip to provide a coil (14). Since it is extended along the border of the chip, the coil (14) can be large enough in size to have sufficient inductance.
(FR)
L'invention porte sur un circuit intégré constitué sur une puce (10) à la périphérie de laquelle sont placés plusieurs plots (12) de raccordement reliés par des fils connecteurs (18) aux bornes du boîtier de la puce (10). Un conducteur disposé à la surface de la puce entre les plots (12) et les bords latéraux de la puce constitue un enroulement (14). Comme il s'étend le long de la lisière de la puce, ledit enroulement peut être suffisamment important pour produire une inductance suffisante.
Also published as
Latest bibliographic data on file with the International Bureau