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1. WO1996041510 - HEAT SINK WITH INTEGRATED BUSS BAR

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[ EN ]

CLAIMS
The embodiments for which an exclusive property or privilege is claimed are defined as follows:
1. In an improved electrical circuit board assembly comprising a first circuit board having a front surface and a rear surface, a second circuit board having a front surface and a rear surface, the circuit boards being provided parallel to one another such that the rear surfaces are opposed and adjacent to one another, and a plurality of circuit modules provided on at least one of the surfaces of the first and second circuit boards, the improvement comprising:
a buss bar provided intermediate the first and second circuit boards and adjacent to the rear surface of the first circuit board, the buss bar being electrically connected to at least one of the circuit modules provided on the first circuit board and at least one of the circuit modules provided on the second circuit board; and
a heat sink provided intermediate the first and second circuit boards and adjacent to both the buss bar and the rear surface of the second circuit board, the heat sink being adapted to thermally conduct heat from the buss bar and circuit modules away therefrom, the heat sink having at least one aperture formed therein for receipt of an electrical connection conduit extending between the buss bar and at least one of the circuit modules of the second circuit board, so that the buss bar can be electrically connected to circuit modules provided on both the first and seconds circuit boards.

2. An improved electrical circuit board assembly according to claim 1 wherein the heat sink further comprises front and rear surfaces and further comprising a depression formed in the front surface, the depression being adapted to receive at least a portion of the buss bar therein.

3. An improved electrical circuit board assembly according to claim 2 and further comprising insulating material provided between the heat sink and the buss bar such that the buss bar and heat sink are electrically insulated from one another.

4. An improved electrical circuit board assembly according to claim 2 and further comprising a cover provided on the front surface of the heat sink, the cover having at least one aperture formed therein for receipt of an electrical connection extending between the buss bar and at least one of the circuit modules of the first circuit board, so that the buss bar can be electrically connected to circuit modules provided on both the first and seconds circuit boards.

5. An improved electrical circuit board assembly according to claim 4 wherein eight apertures are formed in the cover and eight circuit modules are provided on the first circuit board and are electrically connected to the buss bar through eight electrical connection conduits extending through the eight apertures between the buss bar and the cover.

6. An improved electrical circuit board assembly according to claim 4 wherein the cover, in cooperation with the heat sink, substantially encloses the buss bar.

7. An improved electrical circuit board assembly according to claim 4 and further comprising insulating material provided between the cover and the buss bar such that the buss bar and heat sink are electrically insulated from one another.

8. An improved electrical circuit board assembly according to claim 7 and further comprising insulating material provided between the heat sink and the buss bar such that the buss bar and heat sink are electrically insulated from one another.

9. An improved electrical circuit board assembly according to claim 1 wherein eight apertures are formed in the heat sink and eight circuit modules are provided on the second circuit board and are electrically connected to the buss bar through eight electrical connection conduits extending through the eight apertures between the buss bar and the heat sink.

10. An improved electrical circuit board assembly according to claim 9 wherein eight circuit modules are provided on the first circuit board and electrically connected to the buss bar.

11. An electrical circuit board assembly comprising:
a first circuit board having a front surface, a rear surface and at least one circuit module electrically connected to at least one of the front and rear surfaces;
a buss bar provided adjacent the rear surface of the first circuit board, the buss bar having a plurality of terminals provided thereon which are electrically connected to circuit modules on the first circuit board; and
a heat sink provided adjacent the buss bar such that the buss bar is intermediate the heat sink and rear surface of the first circuit board and the heat sink is thermally connected to the circuit modules such that the heat sink is adapted to thermally conduct heat away from the circuit modules.

12. An electrical circuit board assembly according to claim 11 wherein the heat sink further comprises front and rear surfaces and further comprising a depression formed in the front surface, the depression being adapted to receive at least a portion of the buss bar therein.

13. An electrical circuit board assembly according to claim 12 and further comprising insulating material provided between the heat sink and the buss bar such that the buss bar and heat sink are electrically insulated from one another.

14. An electrical circuit board assembly according to claim 12 and further comprising a cover provided on the front surface of the heat sink, the cover having at least one aperture formed therein for receipt of at least one terminal extending from the buss bar to at least one of the circuit modules of the first circuit board, so that the buss bar can be electrically connected to circuit modules provided on both the first circuit board.

15. An electrical circuit board assembly according to claim 14 wherein the cover, in cooperation with the heat sink, substantially encloses the buss bar.

16. An electrical circuit board assembly according to claim 14 and further comprising insulating material provided between the cover and the buss bar such that the buss bar and heat sink are electrically insulated from one another.

17. An electrical circuit board assembly according to claim 16 and further comprising insulating material provided between the heat sink and buss bar such that the buss bar and heat sink are electrically insulated from one another.

18. An electrical circuit board assembly according to claim 11 and further comprising a second circuit board having a plurality of circuit modules electrically connected thereto, the second circuit board being provided adjacent the heat sink such that the buss bar and heat sink are provided intermediate the first and second circuit boards.

19. An electrical circuit board assembly according to claim 18 and further comprising at least one aperture formed in the heat sink, the aperture being adapted to receive an electrical connector extending between the buss bar and at least one of the circuit modules provided on the second circuit board.

20. An electrical circuit board assembly comprising:
first and second circuit boards, each board having an outer edge and at least one circuit module electrically connected to the board;
a buss bar provided intermediate the two circuit boards, the buss bar having a plurality of terminals provided thereon which are electrically connected to the circuit modules on both the first and second circuit boards; and a heat sink provided intermediate the two circuit boards and adjacent to the buss bar, the heat sink having the at least one circuit modules thermally connected thereto and extending outwardly from the circuit boards and having an outer edge adapted for contact with a frame to thermally conduct heat away from the circuit modules to the frame.

21. An electrical circuit board assembly according to claim 20 wherein the heat sink has at least one aperture provided therein for the receipt of at least one buss bar terminal extending from the buss bar to at least one of the circuit modules of the second circuit board.

22. An electrical circuit board assembly according to claim 20 wherein the heat sink has a depression formed in a front surface thereof, the depression being adapted to receive at least a portion of the buss bar therein.

23. An electrical circuit board assembly comprising:
first and second circuit boards, each having at least one circuit module provided thereon;
a buss bar provided intermediate the two circuit boards, the buss bar having a plurality of terminals provided thereon which are electrically connected to circuit modules on both the first and second circuit boards;
a heat sink provided intermediate the two circuit boards, the heat sink being thermally connected to the circuit modules and adapted to thermally conduct heat away from the circuit modules, the heat sink having at least one aperture provided therein for the receipt of at least one buss bar terminal extending from the buss bar to at least one of the circuit modules of the second circuit board and a depression formed in a front surface thereof, the depression being adapted to receive at least a portion of the buss bar therein;
insulating material provided between the heat sink and buss bar such that the buss bar and heat sink are electrically insulated from one another;
a cover provided on the front surface of the heat sink, the cover having at least one aperture formed therein for receipt of at least one terminal extending from the buss bar to at least one of the circuit modules of the first circuit board; and
insulating material provided between the cover and the buss bar such that the buss bar and heat sink are electrically insulated from one another.