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1. WO1996041510 - HEAT SINK WITH INTEGRATED BUSS BAR

Publication Number WO/1996/041510
Publication Date 19.12.1996
International Application No. PCT/US1995/007339
International Filing Date 07.06.1995
Chapter 2 Demand Filed 02.01.1997
IPC
H05K 7/14 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
14Mounting supporting structure in casing or on frame or rack
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H05K 7/1461
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
14Mounting supporting structure in casing or on frame or rack
1461Slidable card holders; Card stiffeners; Control or display means therefor
H05K 7/20545
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20536for racks or cabinets of standardized dimensions, e.g. 19-inch electronic racks
20545Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
Applicants
  • SMITHS INDUSTRIES AEROSPACE & DEFENSE SYSTEMS, INC. [US]/[US] (AllExceptUS)
  • BUJTAS, Geza [US]/[US] (UsOnly)
  • HUPP, Robert, A. [US]/[US] (UsOnly)
Inventors
  • BUJTAS, Geza
  • HUPP, Robert, A.
Agents
  • VISSERMAN, Peter
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) HEAT SINK WITH INTEGRATED BUSS BAR
(FR) PUITS DE CHALEUR A BARRE OMNIBUS INTEGREE
Abstract
(EN)
The invention centers around a circuit board assembly (12) having a heat sink (30) with a buss bar (20) integrally formed therein. Preferably, the heat sink (30) is provided between two parallel, opposed circuit boards (14, 16). The buss bar (20) is provided between the two circuit boards and is in electrical contact with circuit modules (18) provided on both of the circuit boards (14, 16). The heat sink (30) effectively conveys heat away from the circuit board assembly (12) generated by current flowing through the several circuit modules (18) provided on the circuit boards (14, 16). Preferably, the buss bar (20) is electrically insulated from both the circuit boards (14, 16) and the heat sink (30) but electrically connected to the circuit modules (18) provided on the surfaces of the circuit boards (14, 16) by terminals (56, 58) protruding from the opposed surfaces of the buss bar (20).
(FR)
Cette invention concerne un ensemble de plaquettes de circuits (12) ayant un puits de chaleur (30) à barre omnibus intégrée (20). De préférence, le puits de chaleur (30) est disposé entre deux plaquettes de circuits opposées et parallèles (14, 16). La barre omnibus (20) est disposée entre les deux plaquettes de circuits et est en contact électrique avec des modules (18) de circuits situés sur les deux plaquettes de circuits (14, 16). Le puits de chaleur (30) dissipe efficacement la chaleur émanant de l'ensemble de plaquettes de circuits (12), chaleur produite par le passage du courant à travers plusieurs modules (18) de circuits des plaquettes de circuits (14, 16). De préférence, la barre omnibus (20) est électriquement isolée, d'une part, des plaquettes de circuits (14, 16) et d'autre part, du puits de chaleur (30) mais elle est reliée électriquement aux modules (18) de circuits se trouvant à la surface des plaquettes de circuits (14, 16) par des bornes (56, 58) formant saillie sur les faces opposées de la barre omnibus (20).
Also published as
US08973229
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