Processing

Please wait...

Settings

Settings

Goto Application

1. WO1996038858 - METHOD AND PROBE CARD FOR TESTING SEMICONDUCTOR DEVICES

Publication Number WO/1996/038858
Publication Date 05.12.1996
International Application No. PCT/US1996/008117
International Filing Date 24.05.1996
Chapter 2 Demand Filed 19.12.1996
IPC
B23K 20/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
C23C 18/16 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
C25D 5/08 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
08Electroplating with moving electrolyte, e.g. jet electroplating
C25D 5/22 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
22Electroplating combined with mechanical treatment during the deposition
C25D 7/12 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7Electroplating characterised by the article coated
12Semiconductors
C25D 21/02 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
21Processes for servicing or operating cells for electrolytic coating
02Heating or cooling
CPC
B23K 20/004
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
002specially adapted for particular articles or work
004Wire welding
B23K 2101/40
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
36Electric or electronic devices
40Semiconductor devices
C25D 21/02
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
21Processes for servicing or operating cells for electrolytic coating
02Heating or cooling
C25D 5/08
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
08Electroplating with moving electrolyte ; , characterised by electrolyte flow; , e.g. jet electroplating
C25D 5/22
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
22Electroplating combined with mechanical treatment during the deposition
G01R 1/06711
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
Applicants
  • FORMFACTOR, INC. [US]/[US] (AllExceptUS)
  • KHANDROS, Igor, Y. [US]/[US] (UsOnly)
  • ELDRIDGE, Benjamin, N. [US]/[US] (UsOnly)
  • MATHIEU, Gaetean, L. [CA]/[US] (UsOnly)
  • DOZIER, Thomas, H. [US]/[US] (UsOnly)
  • SMITH, William, D. [US]/[US] (UsOnly)
Inventors
  • KHANDROS, Igor, Y.
  • ELDRIDGE, Benjamin, N.
  • MATHIEU, Gaetean, L.
  • DOZIER, Thomas, H.
  • SMITH, William, D.
Agents
  • SUEOKA, Greg, T.
Priority Data
08/452,25526.05.1995US
08/526,24621.09.1995US
08/533,58418.10.1995US
08/554,90209.11.1995US
08/558,33215.11.1995US
60/012,02721.02.1996US
PCT/US95/1490913.11.1995US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD AND PROBE CARD FOR TESTING SEMICONDUCTOR DEVICES
(FR) PROCEDE ET CARTE-SONDE DESTINES A L'ESSAI DE DISPOSITIFS A SEMI-CONDUCTEURS
Abstract
(EN)
A plurality of contact elements, such as contact bumps or free-standing spring contacts including both monolithic and composite interconnection elements (514, 516, 524), are mounted to relatively small tile substrates which, in turn, are mounted and connected to a relatively large electronic component substrate (512), thereby populating the electronic component with a plurality of contact elements while avoiding the necessity of yielding the contact elements directly upon the electronic component. The relatively large electronic component is suitably a space transformer (506) component of a probe card assembly (500). In this manner, pressure connections can be made to an entire semiconductor wafer, at once, to provide for wafer-level burn-in, and the like. Solder balls, Z-axis conductive adhesive, or compliant connections are suitably employed for making electrical connections between the tile substrates and the electronic component. Multiple die sites on a semiconductor wafer (508) are readily probed using the disclosed techniques, and the tiles can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described. Techniques for maintaining a prescribed X-Y and Z-axis alignment of the tiles to the relatively large substrate are disclosed.
(FR)
L'invention concerne une pluralité d'éléments de contact, tels que des bosses de contact ou des contacts à ressorts autonomes, comprenant des éléments (514, 516, 524) d'interconnexion monolithiques et composites. Ces éléments de contact sont fixés sur des substrats de pavés relativement petits qui, à leur tour, sont fixés et connectés à un substrat (512) de composant élecronique relativement grand. Cela permet de placer plusieurs éléments de contact sur le composant électronique, tout en évitant la nécessité de placer ces éléments directement sur le composant électronique. Le composant électronique de taille relativement grande est un composant transformateur (506) d'espace approprié d'un ensemble (500) cartes-sondes. Ainsi, les connexions par pression peuvent être réalisées sur la totalité d'une plaquette à gravure en semi-conducteurs, en une seule fois, pour assurer le vieillissement au niveau de la plaquette, et similaires. Des globules de soudage, un adhésif conducteur sur l'axe des Z ou des connexions élastiques sont utilisées, de manière appropriée, pour assurer des connexions électriques entre les substrats de pavés et le composant électronique. Plusieurs sites de dés sur une plaquette (508) à semi-conducteurs sont rapidement sondés à l'aide des techniques décrites, et les pavés peuvent être disposés de manière à optimiser le sondage de la totalité de la plaquette. L'invention traite également d'éléments d'interconnexion composites, présentant une partie centrale, relativement souple recouverte d'une enveloppe relativement dure, utilisés comme structures de contact élastiques. L'invention décrit aussi des techniques pour maintenir un alignement des pavés sur les axes des x, y et z par rapport à des substrats de tailles relativement grandes.
Also published as
US08789147
Latest bibliographic data on file with the International Bureau