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1. WO1996032744 - PROCESS FOR PRODUCING A SUPPORT AND DEVICE FOR IMPLEMENTING IT

Publication Number WO/1996/032744
Publication Date 17.10.1996
International Application No. PCT/DE1996/000637
International Filing Date 10.04.1996
IPC
G06K 19/077 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
H01L 21/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
CPC
G06K 19/07745
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07745Mounting details of integrated circuit chips
H01L 21/565
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
565Moulds
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
Applicants
  • SIEMENS AKTIENGESELLSCHAFT [DE]/[DE] (AllExceptUS)
  • FISCHER, Jürgen [DE]/[DE] (UsOnly)
Inventors
  • FISCHER, Jürgen
Priority Data
195 13 797.311.04.1995DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUM HERSTELLEN EINES TRÄGERELEMENTES UND VORRICHTUNG ZUR DURCHFÜHRUNG DES VERFAHRENS
(EN) PROCESS FOR PRODUCING A SUPPORT AND DEVICE FOR IMPLEMENTING IT
(FR) PROCEDE POUR PRODUIRE UN SUPPORT ET DISPOSITIF PERMETTANT SA MISE EN ×UVRE
Abstract
(DE)
Zum Vermeiden von Bleed und Flash beim Umspritzen eines auf einem Leadframe (1) montierten Halbleiterchips (3) werden in dem einen von zwei Gießformteilen (6, 8) Niederhalter (9) derart angebracht, daß die freien Enden der Leadframe-Kontaktelemente (1, 1a) von dem einen Gießformteil (8) gegen das andere Gießformteil (6) gedrückt werden. In vorteilhafter Weise werden die dadurch entstehenden Löcher in der den Halbleiterchip (3) umgebenden Kunststoffmasse (4) mit Klebstoff aufgefüllt.
(EN)
In order to prevent bleed and flash in the extrusion coating of a semiconductor chip (3) fitted on a lead frame (1) pressure pads (9) are provided in one of two casting mould halves (6, 8) in such a way that the free ends of the lead frame contacts (1, 1a) are pressed by one mould half (8) against the other (6). The holes thus made in the plastic material (4) surrounding the semiconductor chip (3) are advantageously filled with adhesive.
(FR)
Pour éviter le dégorgement et les bavures lors du revêtement par extrusion d'une puce de semi-conducteur (3) montée sur une grille de connexion (1), des serre-flans (9) sont disposés dans l'une de deux parties de moule (6, 8) de telle manière que les extrémités libres de contact (1, 1a) de la grille de connexion sont pressées par une partie de moule (8) contre l'autre partie de moule (6). Les trous ainsi réalisés dans la matière plastique (4) entourant la puce de semi-conducteur (3) sont avantageusement remplis d'adhésif.
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