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1. WO1996030163 - A WAFER RETAINER FOR RETAINING A WAFER TO BE POLISHED AND A METHOD FOR ATTACHING/DETACHING THE WAFER RETAINER TO/FROM A BASE PLATE OF A POLISHING MACHINE

Publication Number WO/1996/030163
Publication Date 03.10.1996
International Application No. PCT/JP1996/000806
International Filing Date 27.03.1996
Chapter 2 Demand Filed 10.10.1996
IPC
B24B 37/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
C08L 33/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
33Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Compositions of derivatives of such polymers
04Homopolymers or copolymers of esters
C09J 7/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
02on carriers
H01L 21/68 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68for positioning, orientation or alignment
H01L 21/687 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
CPC
B24B 37/30
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
27Work carriers
30for single side lapping of plane surfaces
C08L 33/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
33Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
04Homopolymers or copolymers of esters
C09J 7/22
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
22Plastics; Metallised plastics
C09J 7/26
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
22Plastics; Metallised plastics
26Porous or cellular plastics
C09J 7/38
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives [PSA]
H01L 21/68
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
Applicants
  • NITTA CORPORATION [JP]/[JP] (AllExceptUS)
  • ISHII, Hideyuki [JP]/[JP] (UsOnly)
  • SHIGETA, Yoshitane [JP]/[JP] (UsOnly)
Inventors
  • ISHII, Hideyuki
  • SHIGETA, Yoshitane
Agents
  • YAMAMOTO, Shusaku
Priority Data
7/7210529.03.1995JP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) A WAFER RETAINER FOR RETAINING A WAFER TO BE POLISHED AND A METHOD FOR ATTACHING/DETACHING THE WAFER RETAINER TO/FROM A BASE PLATE OF A POLISHING MACHINE
(FR) DISPOSITIF DE RETENUE D'UNE TRANCHE A POLIR ET PROCEDE DE FIXATION ET DE LIBERATION DU DISPOSITIF DE RETENUE DE LA TRANCHE SUR LA PLAQUE DE BASE D'UNE MACHINE A POLIR
Abstract
(EN)
A wafer retainer for retaining a wafer to be polished according to the present invention includes: a foam layer (2) capable of adsorbing a wafer on a surface of the foam layer (2) in a detachable manner; a pressure-sensitive adhesive layer (3) for attaching the foam layer (2) to a base plate (7) of a polishing machine; and a release sheet (4) attached to the pressure-sensitive adhesive layer (3) in a releasable manner, wherein the pressure-sensitive adhesive layer (3) includes an adhesive composition containing a polymer, the polymer having a first-order melt transition in a temperature range narrower than 15 °C. Thus, the present invention provides a wafer retainer and a method for attaching/detaching the wafer retainer to/from a base plate of a polishing machine such that the wafer retainer can be peeled off the base plate by simply cooling the base plate (7) and the adhesive layer (3) of the wafer retainer, thereby facilitating the exchanging or replacement of the wafer retainer occurring after each polishing process.
(FR)
La présente invention concerne un dispositif de retenue, destiné à retenir une tranche devant être polie, et qui comprend: une couche de mousse (2), capable d'adsorber une tranche à sa surface, de façon amovible; une couche (3) d'adhésif sensible à la pression servant à fixer la couche de mousse (2) à la plaque de base (7) d'une machine à polir, et une feuille détachable (4) fixée de manière amovible à la couche (3) d'adhésif sensible à la pression. Cette dernière comprend une composition adhésive contenant un polymère qui a une transition à l'état fondu de premier ordre dans une plage de températures plus étroite que 15 degrés C. Ainsi, la présente invention fournit un dispositif de retenue d'une tranche et un procédé de fixation et de libération du dispositif de retenue sur la plaque de base d'une machine à polir, de manière à ce que le dispositif de retenue de la tranche puisse être détaché de la plaque de base (7) simplement par refroidissement de celle-ci et de la couche d'adhésif (3) du dispositif de retenue de la tranche, ce qui facilite l'échange ou le remplacement du dispositif de retenue de la tranche, qui a lieu après chaque opération de polissage.
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