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1. WO1996027280 - THERMALLY AND ELECTRICALLY ENHANCED BALL GRID PACKAGE

Publication Number WO/1996/027280
Publication Date 06.09.1996
International Application No. PCT/US1996/002000
International Filing Date 15.02.1996
Chapter 2 Demand Filed 09.08.1996
IPC
H01L 23/13 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
13characterised by the shape
H01L 23/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/498 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
498Leads on insulating substrates
H01L 23/64 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/49109
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
491Disposition
49105Connecting at different heights
49109outside the semiconductor or solid-state body
H01L 23/13
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
13characterised by the shape
H01L 23/142
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
142Metallic substrates having insulating layers
H01L 23/36
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
Applicants
  • INTEL CORPORATION [US]/[US]
Inventors
  • BANERJEE, Koushik
  • MALLIK, Debendra
  • SETH, Ashok
Agents
  • YORKS, Ben, J.
  • MALLIE, Michael, J.
Priority Data
08/399,16202.03.1995US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) THERMALLY AND ELECTRICALLY ENHANCED BALL GRID PACKAGE
(FR) BOÎTIER A GRILLES DE GLOBULES DE SOUDURE AMELIORE SUR LE PLAN THERMIQUE ET ELECTRIQUE
Abstract
(EN)
An integrated circuit package (10) which has internal bonding pads (46) that are located on bonding shelves and coupled to internal conductive power/ground planes (20, 24, 28) by conductive strips (52) that extend along the edges of the shelves. The edge strips eliminate the need for conventional vias to couple the bonding pads to the planes and thus reduce the cost and size of the package and improve package electrical performance (less inductive, less resistance path). The bonding pads are coupled to an integrated circuit (12) that is mounted to a heat slug (54) attached to a top surface of the package. The heat slug can function as both a ground path and a thermal sink for the integrated circuit. The package may have capacitors (62) coupled to the internal routing of the package to reduce the electrical noise of the signals provided to the integrated circuit. Additionally, the package may have multiple power planes dedicated to different voltage levels. The bonding pads and conductive planes are coupled to landing pads located on a bottom surface of the package. Attached to the landing pads are solder balls (68) which can be soldered to an external printed circuit board (72).
(FR)
Boîtier de circuit imprimé présentant des plages de connexion intérieures (46) placées sur des travées de connexion et reliées à des plans de terre d'alimentation conducteurs internes (20, 24, 28) par des bandes conductrices (52) s'étendant le long des bords des travées et permettant d'éliminer la nécessité d'utiliser des traversées traditionnelles pour relier les plages de connexion aux plans, de réduire le coût et la taille des boîtiers et d'améliorer simultanément le comportement électrique (inductances et résistances réduites) de ces derniers. Les plages de connexion sont reliées au circuit intégré (12) monté sur une masse thermique (54) reliée à la surface supérieure du boîtier. La masse thermique peut à la fois servir de liaison à la terre et de puits thermique pour le CI. Le boîtier peut par ailleurs comporter des condensateurs (62) reliés aux circuits internes de l'ensemble et diminuant le bruit électrique des signaux alimentant le CI, ainsi que de multiples plans d'alimentation correspondant aux différents niveaux de tension. Les plages de connexion et les plans conducteurs sont couplés à des plages de réception terminales situées à des plages de raccordement terminales situées sur la surface inférieure du boîtier. Des globules de soudure (68) liées aux plages de réception peuvent être soudées à une plaquette de circuit imprimé (72) extérieure.
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