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1. WO1996019734 - METHOD AND APPARATUS FOR SEMICONDUCTOR DIE TESTING

Publication Number WO/1996/019734
Publication Date 27.06.1996
International Application No. PCT/GB1995/002557
International Filing Date 01.11.1995
Chapter 2 Demand Filed 08.06.1996
IPC
G01R 1/04 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02General constructional details
04Housings; Supporting members; Arrangements of terminals
G01R 1/073 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
073Multiple probes
CPC
G01R 1/0483
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
0433Sockets for IC's or transistors
0483Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
G01R 1/0735
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
073Multiple probes
07307with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
0735arranged on a flexible frame or film
Applicants
  • FORD MOTOR COMPANY [US]/[US] (AT, BE, CH, CN, DE, DK, ES, FR, GB, GR, IE, IT, JP, KR, LU, MC, NL, PT, SE)
  • FORD MOTOR COMPANY LIMITED [GB]/[GB] (GB)
Inventors
  • WALLES, Bethany, Joy
  • PHAM, Cuong, Nan
  • KNEISEL, Lawrence, Leroy
  • HAYDEN, Brian, John
Agents
  • MESSULAM, Alec, Moses
Priority Data
358,29719.12.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD AND APPARATUS FOR SEMICONDUCTOR DIE TESTING
(FR) PROCEDE ET APPAREIL PERMETTANT DE TESTER DES PUCES DE SEMI-CONDUCTEURS
Abstract
(EN)
A test apparatus for testing a known-good die integrated circuit (10) is disclosed. The test apparatus uses conductive straps (18) extending across trenches (20). The straps (18) align with bond pads (14) on the integrated circuit (10). When the bond pads (14) are brought into contact with the straps (18), the straps (18) exert a counterforce in the opposite direction to ensure a good electrical contact while testing the integrated circuit.
(FR)
Appareil de test permettant de contrôler une puce réputée bonne de circuit intégré (10), qui utilise des bandes conductrices (18) s'étendant au-dessus de tranchées (20). Lesdites bandes (18) sont alignées avec des plots de connexion (14) situés sur les circuits intégrés (10). Lorsque les plots de connexion (14) sont mis en contact avec les bandes (18), lesdites bandes (18) exercent une force antagoniste dans la direction opposée pour assurer un bon contact électrique lors du test du circuit intégré.
Also published as
KR1019970703570
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