Processing

Please wait...

Settings

Settings

Goto Application

1. WO1996018284 - FABRICATION MULTILAYER COMBINED RIGID/FLEX PRINTED CIRCUIT BOARD

Publication Number WO/1996/018284
Publication Date 13.06.1996
International Application No. PCT/US1995/015708
International Filing Date 04.12.1995
Chapter 2 Demand Filed 23.05.1996
IPC
H05K 1/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H05K 3/06 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
CPC
H05K 1/0393
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0393Flexible materials
H05K 2203/1147
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
11Treatments characterised by their effect, e.g. heating, cooling, roughening
1147Sealing or impregnating, e.g. of pores
H05K 2203/1536
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
15Position of the PCB during processing
1536Temporarily stacked PCBs
H05K 3/0097
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
H05K 3/06
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K 3/281
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
281by means of a preformed insulating foil
Applicants
  • TELEDYNE INDUSTRIES, INC. [US]/[US]
Inventors
  • CARON, A., Roland
  • MILLETTE, Lee, J.
  • KING, John, G.
Agents
  • SOLOWAY, Norman, P.
Priority Data
08/349,25405.12.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) FABRICATION MULTILAYER COMBINED RIGID/FLEX PRINTED CIRCUIT BOARD
(FR) FABRICATION DE PLAQUETTES DE CIRCUITS IMPRIMES RIGIDES ET SOUPLES COMBINEES MULTICOUCHES
Abstract
(EN)
Multilayer rigid flex printed circuits are fabricated from a novel basestock composite (10) comprising two copper conducting sheets (12, 14), bonded to insulator layers (16, 18) comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to Kapton layers (20, 23) wherein said Kapton layers are not coextensive with the borders (24) of the insulator layers. The basestock composite (10) can then be imaged and etched on the conductor layers (16, 18) to form conductor patterns (22), laminated or coated with a coverlay (30) of dielectric material, and the basestock can be cut at a point internal to its borders (24) and into the Kapton layers thereby separating two imaged and etched conductor layers.
(FR)
Des circuits imprimés rigides et souples multicouches sont fabriqués à partir d'un nouveau matériau de support composite (10) comprenant deux feuilles de cuivre conductrices (12, 14), collées aux couches (16, 18) formant isolant, constituées de feuilles de fibres de verre imprégnées d'un adhésif tel que de l'époxy. Les couches formant isolant sont toutes deux fixées aux couches de Kapton (20, 23), ces couches n'étant pas coextensibles par rapport aux bords (24) des couches formant isolant. Les images peuvent alors être formées sur le matériau de support composite (10) et réalisées par photogravure sur les couches formant conducteur (16, 18) pour former des motifs de conducteurs (22), stratifiés ou recouverts d'une couche de revêtement (30) d'un matériau diélectrique. Ensuite, le matériau de support peut être coupé au niveau d'un point interne par rapport à ses bords (24) et dans les couches de Kapton, séparant ainsi deux couches formant conducteur imagées et réalisées par photogravure.
Latest bibliographic data on file with the International Bureau