Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO1996010279) SOLDER-BEARING LEAD AND METHOD OF PRODUCING AND USING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/1996/010279 International Application No.: PCT/US1995/013109
Publication Date: 04.04.1996 International Filing Date: 28.09.1995
Chapter 2 Demand Filed: 29.04.1996
IPC:
H01R 4/02 (2006.01) ,H01R 43/02 (2006.01) ,H05K 3/34 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
02
Soldered or welded connections
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
43
Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
02
for soldered or welded connections
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
SEIDLER, Jack [US/US]; US (UsOnly)
POLLOCK, Leonard, J. [US/US]; US (UsOnly)
NORTH AMERICAN SPECIALTIES CORPORATION [US/US]; 120-12 28th Avenue Flushing, NY 11354, US (AllExceptUS)
Inventors:
SEIDLER, Jack; US
POLLOCK, Leonard, J.; US
Agent:
RELSON, Morris ; Darby & Darby P.C. 805 Third Avenue New York, NY 10022, US
YANNEY, Pierre, R.; Darby & Darby P. C. 805 Third Avenue New York, NY 10022, US
Priority Data:
315,20429.09.1994US
512,50808.08.1995US
Title (EN) SOLDER-BEARING LEAD AND METHOD OF PRODUCING AND USING SAME
(FR) CONDUCTEUR PORTEUR DE SOUDURE A L'ETAIN ET PROCEDE DE FABRICATION
Abstract:
(EN) A solder-bearing metallic (114), and methods of fabricating and using it, where the lead is formed with a solder-retaining portion (125) having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder (133) surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a susbstrate or other conductive pad.
(FR) On décrit un conducteur métallique porteur de soudure à l'étain (114) et des procédés permettant de le fabriquer et de l'utiliser. Ce conducteur est formé à partir d'un segment porteur de soudure à l'étain (125), dont la section, qui présente des échancrures, peut être en forme de V ou plate. La soudure à l'étain (133) entoure ce segment et ces échancrures et part du conducteur vers l'extérieur tout en en laissant une partie dégarnie pour que le métal du conducteur établisse un contact direct avec un substrat ou une plage conductrice.
Designated States: AM, AT, AU, BB, BG, BR, BY, CA, CH, CN, CZ, DE, DK, EE, ES, FI, GB, GE, HU, IS, JP, KE, KG, KP, KR, KZ, LK, LR, LT, LU, LV, MD, MG, MK, MN, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, TJ, TM, TT, UA, US, UZ, VN
African Regional Intellectual Property Organization (ARIPO) (KE, MW, SD, SZ, UG)
European Patent Office (EPO) (AT, BE, CH, DE, DK, ES, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)