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Machine translation
1. (WO1996009128) SELECTIVE REMOVAL OF MATERIAL BY IRRADIATION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1996/009128    International Application No.:    PCT/US1995/011993
Publication Date: 28.03.1996 International Filing Date: 15.09.1995
Chapter 2 Demand Filed:    21.03.1996    
IPC:
B08B 7/00 (2006.01), B23K 26/36 (2006.01), G03F 7/20 (2006.01), H01L 21/306 (2006.01), H01L 21/3205 (2006.01), H01L 21/321 (2006.01), H01L 21/768 (2006.01)
Applicants: CAULDRON LIMITED PARTNERSHIP [US/US]; Suite 512, 4405 East-West Highway, Bethesda, MD 20814 (US) (For All Designated States Except US).
ENGELSBERG, Audrey, C. [US/US]; (US) (For US Only).
FITZPATRICK, Donna, R. [US/US]; (US) (For US Only)
Inventors: ENGELSBERG, Audrey, C.; (US).
FITZPATRICK, Donna, R.; (US)
Agent: DEGRANDI, Joseph, A.; Beveridge, DeGrandi, Weilacher & Young, Suite 800, 1850 M Street, N.W., Washington, DC 20036 (US)
Priority Data:
08/306,431 19.09.1994 US
Title (EN) SELECTIVE REMOVAL OF MATERIAL BY IRRADIATION
(FR) ELIMINATION SELECTIVE DE MATERIAUX PAR IRRADIATION
Abstract: front page image
(EN)An apparatus and method for selectively removing undesired material from the surface of a substrate provides a flow of inert gas over the undesired material susbtrate surface while irradiating the undesired material with energetic photons. The invention enables removal of undesired material without altering the physical properties of the material underlying or adjacent the removed, undesired material. The invention can be applied to produce changes in surface topography (including nano-structuring and surface planarization).
(FR)Appareil et procédé d'élimination sélective de matériaux indésirables de la surface d'un substrat consistant à diriger un flux d'un gaz inerte sur la surface dudit substrat tout en irradiant les matériaux indésirables par des photons énergétiques. L'invention permet ladite élimination sans altérer les propriétés physiques des matériaux se trouvant sous ou à côté de la zone où se trouvent les matériaux indésirables à éliminer. On peut utiliser l'invention pour modifier la topographie de surfaces (y compris pour la nanostructuration et l'aplanissement de surfaces).
Designated States: AM, AT, AU, BB, BG, BR, BY, CA, CH, CN, CZ, DE, DK, EE, ES, FI, GB, GE, HU, IS, JP, KE, KG, KP, KR, KZ, LK, LR, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, TJ, TM, TT, UA, UG, US, UZ, VN.
African Regional Intellectual Property Organization (KE, MW, SD, SZ, UG)
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)