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1. WO1996008338 - PROCESS AND DEVICE FOR APPLYING BONDING MATERIAL TO A SUBSTRATE CONNECTION SURFACE

Publication Number WO/1996/008338
Publication Date 21.03.1996
International Application No. PCT/DE1995/001239
International Filing Date 08.09.1995
IPC
B23K 1/06 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
06making use of vibrations, e.g. supersonic vibrations
B23K 3/06 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
B23K 20/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
CPC
B01J 2219/00468
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
2219Chemical, physical or physico-chemical processes in general; Their relevant apparatus
00274Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
00277Apparatus
00457Dispensing or evacuation of the solid phase support
00459Beads
00468by manipulation of individual beads
B23K 1/06
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
06making use of vibrations, e.g. supersonic vibrations
B23K 20/007
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
002specially adapted for particular articles or work
004Wire welding
005Capillary welding
007Ball bonding
B23K 3/0623
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
0607Solder feeding devices
0623for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
H01L 2224/78301
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
78Apparatus for connecting with wire connectors
7825Means for applying energy, e.g. heating means
783by means of pressure
78301Capillary
H01L 2224/85205
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
85using a wire connector
852Applying energy for connecting
85201Compression bonding
85205Ultrasonic bonding
Applicants
  • FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. [DE]/[DE] (AllExceptUS)
  • ELDRING, Joachim [DE]/[DE] (UsOnly)
  • JUNG, Erik [DE]/[DE] (UsOnly)
  • ZAKEL, Elke [DE]/[DE] (UsOnly)
Inventors
  • ELDRING, Joachim
  • JUNG, Erik
  • ZAKEL, Elke
Agents
  • TAPPE, Hartmut
Priority Data
P 44 32 579.713.09.1994DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN UND VORRICHTUNG ZUR APPLIKATION VON VERBINDUNGSMATERIAL AUF EINER SUBSTRATANSCHLUSSFLÄCHE
(EN) PROCESS AND DEVICE FOR APPLYING BONDING MATERIAL TO A SUBSTRATE CONNECTION SURFACE
(FR) PROCEDE ET DISPOSITIF D'APPLICATION D'UN MATERIAU DE CONNEXION SUR UNE PLAGE DE CONNEXION SUR UN SUBSTRAT
Abstract
(DE)
Verfahren und Vorrichtung zur Applikation von stückigem, insbesondere kugelförmigem Verbindungsmaterial (11) auf einer Substratanschlußfläche (12), bei dem das Verbindungsmaterial von einer Plaziereinrichtung (14) aufgenommen und nachfolgend auf der Substratanschlußfläche plaziert wird, wobei vor der Plazierung des Verbindungsmaterials (11) durch die Plaziereinrichtung (14) eine Vereinzelung und eine Zentrierung des Verbindungsmaterials gegenüber der Plaziereinrichtung erfolgt.
(EN)
A process and device are disclosed for applying a bonding material (11) in the form of discrete measures, in particular globules, to a substrate connection surface (12). In the proposed process, the bonding material is taken up by a placement device (14) and subsequently placed on the substrate connection surface; before being placed by the placement device (14), the bonding material (11) is formed into a globule and centred in relation to the placement device.
(FR)
L'invention concerne un procédé et un dispositif d'application d'un matériau de connexion (11) en morceaux, notamment de forme sphérique, sur une plage de connexion (12) sur un substrat. Selon ce procédé, le matériau de connexion est logé dans une unité de positionnement (14) qui le place ensuite sur la plage de connexion. Avant le positionnement du matériau de connexion (11) par l'unité de positionnement (14), celui-ci est séparé en éléments individuels et centré par rapport à l'unité de positionnement.
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