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1. WO1996006459 - COMPONENT STACKING IN MULTI-CHIP SEMICONDUCTOR PACKAGES

Available information on National Phase entries(more information)
OfficeEntry DateNational NumberNational Status
European Patent Office 16.03.19961995930961Published: 14.08.1996
Granted: 02.01.2002
Republic of Korea 25.04.19961019960702119Expired: 26.08.2015