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1. WO1996006459 - COMPONENT STACKING IN MULTI-CHIP SEMICONDUCTOR PACKAGES

Publication Number WO/1996/006459
Publication Date 29.02.1996
International Application No. PCT/US1995/010837
International Filing Date 25.08.1995
IPC
H01L 25/16 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
H05K 1/16 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
16incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K 1/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
CPC
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 25/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
H01L 25/165
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
165Containers
H01L 2924/01046
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01046Palladium [Pd]
H01L 2924/01078
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01078Platinum [Pt]
H01L 2924/01079
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01079Gold [Au]
Applicants
  • NATIONAL SEMICONDUCTOR CORPORATION [US]/[US]
Inventors
  • TAKIAR, Hem
  • HEGEL, Uli
  • SPALDING, Peter
  • CROZIER, Jim
  • HOU-CHANG, Michelle
  • DELATEUR, Martin, H.
Agents
  • CONSER, Eugene
Priority Data
08/295,98225.08.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) COMPONENT STACKING IN MULTI-CHIP SEMICONDUCTOR PACKAGES
(FR) EMPILAGE DE COMPOSANTS DANS UN MODULE DE SEMI-CONDUCTEURS MULTIPUCE
Abstract
(EN)
A multi-chip packaging arrangement (10) that contemplates stacking discrete components (18) over film based components (16) is disclosed. The multi-chip package includes a substrate (12) having one or more film based components formed thereon. A discrete component is mounted on the substrate over the film based component such that it is electrically isolated from the film based component. One or more die components (14) are also mounted on the substrate and a plurality of leads (21) are provided for electrically connecting the multi-chip package to external circuitry. Wiring traces (23) formed on the substrate are provided to electrically connect various ones of the components and the leads. A packaging material is provided to encapsulate the components and the wiring traces and leaves a portion of the leads exposed to facilitate electrically connecting the multi-chip package to external circuitry. Methods of making such multi-chip packages are also disclosed.
(FR)
L'invention se rapporte à un agencement de module multipuce (10) permettant d'empiler des composants séparés (18) sur des composants (16) placés sur un film. Le module multipuce se compose d'un substrat (12) comportant au moins un composant placé sur un film. Un composant séparé est monté sur le substrat au-dessus du composant placé sur un film afin qu'il soit isolé électriquement de ce dernier. Au moins un composant pastille (14) est également monté sur le substrat et une pluralité de conducteurs (21) sont ménagés pour connecter électriquement le module multipuce à des circuits externes. Des tracés conducteurs (23) formés sur le substrat sont prévus pour connecter électriquement divers composants et conducteurs. Un matériau de conditionnement permet d'encapsuler les composants et les tracés conducteurs et laisse une partie des conducteurs en vue pour faciliter la connexion électrique du module multipuce aux circuits externes. L'invention se rapporte également à des procédés de fabrication de modules multipuces.
Also published as
Latest bibliographic data on file with the International Bureau